SE200AB Electronic Protective Gel | 2.0W/mK | TOUSEN

SE200AB
The ​SE200AB Electronic Protective Gel​ is an economical ​thermal curing compound​ specifically formulated for applications requiring basic thermal management and component protection. With a 2.0 W/m·K thermal conductivity rating, this effective ​shock absorption material​ provides reliable heat dissipation while offering essential mechanical protection for electronic components. The ​electronic protective gel​ cures into a soft elastomer with Shore 00 hardness of 55±10, ensuring adequate shock absorption capabilities for standard operating conditions.

Technical Performance and Application Benefits

The ​SE200AB thermal curing compound​ demonstrates consistent performance as a cost-effective ​shock absorption material​ in various electronic applications. Featuring excellent flow characteristics (50±5 g/min), this ​electronic protective gel​ allows for easy application through manual or automated dispensing methods. The material provides reliable electrical insulation with dielectric strength >10 kV/mm and volume resistivity >10¹³ Ω·cm, making it suitable for basic power supply units, consumer electronics, and LED applications. As a practical ​thermal curing compound, it maintains stable performance across -50°C to 150°C temperature range while complying with UL94 V-0, RoHS, and REACH standards. The ​SE200AB shock absorption material​ offers an economical thermal management solution for applications where basic component protection and reliable performance are primary requirements.
Quantity:
Free Sample
Product Description

◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.  
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.  
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.  
◆ Excellent flame resistance, achieving a UL94 V-0 rating.  
◆ Curing time adjustable based on temperature.  
◆ Two-component structure for easy storage.  
◆ Can be precisely controlled for thickness and shape using automated equipment.  
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.  
 

【Applications】

◆ CPUs and GPUs  
◆ Power Supply Units (PSUs)  
◆ LED Modules  
◆ Engine Control Units (ECUs)  
◆ Gaming Consoles and Laptops  
 
Properties
 
Characteristic Parameter
PropertiesUnitSE200ABTest Method
Thermal ConductivityW/m·K2.0ASTM D5470
Flow Rate(@50cc,90psi)g/min50±5-
Color Before Curing-Part A: White
Part B: Pink
Visual
Densityg/cc2.1Helium Pycnometry
Mix Ratio-1:1-
Color After Curing-PinkVisual
Hardness After CuringShore 0055±10ASTM D2240
Tack-Free Time (@25℃)min30-
Full Cure Time (@25℃)h1-
Full Cure Time (@100℃)min5-
Minimum Interface Thicknessmm0.10-
Shelf Life (@25℃)months6-
Operating Temp.-50 ~ 150-
Dielectric Strength (@AC)kV/mm>10ASTM D149
Dielectric Constant (@1MHz)-4.0ASTM D150
Volume ResistivityΩ·cm>1013ASTM D257
Coefficient of Thermal Expansionppm/K175ASTM E831
Flame Rating-V-0UL94
RoHS-PASSIEC 62321
Halogen-PASSEN 14582
REACH-PASSEN 14372

【Storage & Transportation】

  Store in a well-ventilated, cool, and dry place, away from open flames.
  This product is non-toxic and should be stored and transported as a non-hazardous material.
 

【Packaging】

  ● 50cc ● 400cc
 

【Shelf Life】

   6 months