CSF 15 Carbon Fiber Thermal Pad | Premium Performance TIM | TOUSEN

The ​CSF 15 Carbon Fiber Thermal Pad​ delivers exceptional 15.0W/mK thermal conductivity, establishing a new ​industry-leading entry-level​ standard that surpasses conventional thermal interface materials. This ​carbon fiber thermal pad​ represents the accessible tier of our premium series, offering performance that exceeds typical silicone-based solutions while maintaining the series' signature mechanical excellence. With 40% elongation and proven compressibility, this ​premium performance TIM​ provides reliable thermal management for applications requiring guaranteed heat dissipation capabilities.

Technical Superiority and Application Excellence

The ​CSF 15 industry-leading entry-level​ solution demonstrates outstanding reliability across 5G infrastructure, industrial electronics, and power management systems. With a thermal impedance of 0.28°C·in²/W at 20psi for 1mm thickness, this ​carbon fiber thermal pad​ ensures effective thermal bridging for various electronic applications. The material's natural adhesion properties and 10±5% compression ratio facilitate straightforward installation while accommodating diverse assembly requirements. Available in thicknesses from 0.3mm to 12.0mm, this ​premium performance TIM​ can be customized for specific applications in control boards, memory modules, and power systems. Maintaining operational stability from -50°C to 160°C with UL94 V-0 certification, the ​CSF 15​ sets a new benchmark for entry-level thermal materials, delivering proven reliability for applications where consistent performance and long-term durability are paramount.