CSF 20 Carbon Fiber Thermal Pad | TOUSEN

The ​CSF 20 Carbon Fiber Thermal Pad​ delivers exceptional 20.0W/mK thermal conductivity, establishing it as a ​premium thermal interface​ solution that outperforms conventional thermal materials. This ​carbon fiber thermal pad​ represents the foundational tier of our high-performance series, offering superior heat transfer capabilities that redefine standards for reliable thermal management. The material maintains excellent mechanical properties with 30% elongation and optimal compressibility, providing a ​high-performance base grade​ solution for applications requiring guaranteed thermal performance.

​Technical Excellence and Application Versatility

The ​CSF 20 premium thermal interface​ demonstrates outstanding reliability across 5G infrastructure, industrial electronics, and power management systems. With a thermal impedance of 0.18°C·in²/W at 20psi for 1mm thickness, this ​carbon fiber thermal pad​ ensures efficient thermal bridging for demanding applications. The material's natural adhesion properties and 10±5% compression ratio facilitate seamless installation while accommodating various assembly requirements. Available in 0.3mm to 12.0mm thicknesses, this ​high-performance base grade​ solution can be customized for specific applications in control boards, memory modules, and power systems. Maintaining operational stability from -50°C to 160°C with UL94 V-0 certification, the ​CSF 20​ represents the entry point to premium thermal performance, delivering unmatched value for applications where proven reliability and consistent thermal management are essential requirements.