SE50 Thermal Gel 5.0W/mK | Single-Part Thermal Putty | TOUSEN

The ​SE50 Thermal Gel​ is a high-performance ​single-part thermal putty​ that delivers reliable 5.0 W/m·K thermal conductivity for various electronic cooling applications. This innovative ​thermal gel​ features a silicone resin-based formulation that provides excellent gap-filling capabilities between heat-generating components and heat sinks. As a versatile ​thermal putty, the material offers low thermal impedance (0.06°C·in²/W) and minimal oil separation, ensuring stable long-term performance. The ​SE50 thermal gel​ combines ease of application with consistent thermal management performance, making it an ideal choice for automated manufacturing processes

Technical Performance and Application Advantages

The ​SE50 thermal putty​ demonstrates reliable performance in applications including CPUs, GPUs, and power supply units. This ​single-part thermal putty​ features excellent extrusion properties (40±5 g/min) and can be precisely controlled using automated dispensing equipment. The material's soft, compressible nature ensures low stress on delicate components while providing optimal surface contact. With dielectric strength exceeding 5000 V/mm and volume resistance >10¹⁴ Ω·cm, this ​thermal gel​ offers both effective thermal management and electrical insulation benefits. The ​SE50 thermal putty​ maintains stable performance across -50°C to 150°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, making it suitable for consumer electronics, LED modules, and various industrial applications where reliability and safety are essential requirements.