SF600G GPU & Server Cooling Solution | TOUSEN

The SF600G High-Computing Thermal Pad provides 6.0W/mK thermal conductivity with 0.30°C·in²/W impedance at 30psi, engineered specifically for high-performance computing applications. This advanced thermal interface material ensures efficient heat transfer from high-power components like GPUs and server processors to cooling systems. With enhanced thermal performance characteristics, the SF600G thermal pad effectively bridges microscopic air gaps between uneven surfaces, maintaining optimal operating temperatures in computationally intensive equipment.

Designed for AI servers, data center infrastructure, and high-performance computing devices, the SF600G maintains stable performance across -50°C to 200°C. The material's balanced compression and recovery properties (Shore 00 40/60±5) ensure consistent contact pressure without damaging delicate components. Excellent dielectric strength (>8kV/mm) and UL94 V-0 certification provide additional safety for sensitive electronic applications. This thermal management solution supports custom die-cutting for precise fitting to specific component layouts, offering reliable cooling for next-generation computing platforms.