SE40 Thermal Gel 4.0W/mK | Single-Part Thermal Putty | TOUSEN

The ​SE40 Thermal Gel​ is a reliable ​single-part thermal putty​ that delivers efficient 4.0 W/m·K thermal conductivity for various electronic cooling applications. This practical ​thermal gel​ features a silicone resin-based formulation that provides effective gap-filling capabilities between heat-generating components and heat sinks. As a versatile ​thermal putty, the material offers balanced thermal impedance (0.06°C·in²/W) and minimal oil separation, ensuring stable performance in diverse operating conditions. The ​SE40 thermal gel​ combines user-friendly application with consistent thermal management performance, making it a cost-effective choice for standard electronic cooling requirements.

Technical Performance and Application Advantages

The ​SE40 thermal putty​ demonstrates dependable performance in applications including CPUs, GPUs, and power supply units. This ​single-part thermal putty​ features good extrusion properties (40±5 g/min) and can be efficiently applied using automated dispensing equipment. The material's compliant nature ensures minimal stress on components while maintaining adequate surface contact. With dielectric strength exceeding 5000 V/mm and volume resistance >10¹⁴ Ω·cm, this ​thermal gel​ provides both thermal management and electrical insulation benefits. The ​SE40 thermal putty​ maintains stable performance across -50°C to 150°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, making it suitable for consumer electronics, LED modules, and general industrial applications where reliable thermal performance and safety are key considerations.