ATDFG Seroes Thermal conductive double-sided tape

The ATD604FG Thermal Conductive Double-Sided Tape is an ultra-thin adhesive solution designed for bonding heat sinks to microprocessors and power semiconductors in compact electronic devices. This thermal conductive tape features a thickness of 0.10mm with thermal conductivity of 0.8 W/m·K, providing efficient heat transfer while maintaining minimal profile for space-constrained applications. The acrylic-based adhesive delivers strong bonding performance with 180°C peel strength of 1.5 KG/inch and holding force exceeding 48 hours at 80°C.

This double-sided thermal tape operates effectively across a temperature range of -40°C to 120°C, ensuring reliable performance in various environmental conditions. With breakdown voltage of 2500 V/mm, the material provides adequate electrical insulation for electronic applications. The substrate-free white tape offers convenient handling and can be custom die-cut into specific shapes to meet diverse design requirements. This thermal conductive adhesive tape serves as an effective alternative to mechanical fasteners and liquid adhesives, simplifying assembly processes.

Applications include electronics manufacturing, printing equipment, LED lighting systems, and hardware components where reliable thermal bonding is essential. The ultra-thin double-sided adhesive eliminates the need for thermal paste drying time, enabling faster production cycles. Its easy removal capability facilitates maintenance and rework procedures while maintaining clean surfaces.

The thermal conductive double-sided tape is particularly suitable for applications requiring fluid-free thermal interface materials or where traditional mounting methods are impractical. With ROHS compliance and no substrate requirements, this solution offers versatility for various industrial applications. The material's balanced combination of thermal performance, adhesive strength, and ease of use makes it ideal for high-volume manufacturing environments.