AF100 Basic Non-Silicone Thermal Pad | TOUSEN

The ​AF100 Basic Non-Silicone Thermal Pad​ provides reliable 1.5W/mK thermal conductivity with a thermal impedance of 1.10°C·in²/W at 30psi. This ​general electronics grade​ material offers balanced performance for applications requiring ​contamination-free thermal interface​ protection. The ​non-silicone thermal pad​ eliminates risks of siloxane volatilization and silicone oil bleeding, ensuring operational stability in various electronic equipment including sensors, data centers, and medical devices. With its focus on preventing mirror fogging and electrical failures, this ​basic non-silicone thermal pad​ delivers consistent thermal management without compromising safety or reliability.

​Technical Performance and Application Range:​

The ​AF100 basic non-silicone thermal pad​ demonstrates consistent performance across a wide range of applications, including automotive systems, industrial controls, and AI devices. With thickness options from 0.5mm to 5.0mm and Shore 00 hardness of 50/70±8, this ​general electronics grade​ material accommodates diverse assembly requirements while maintaining 100% elongation and 75psi tensile strength. The ​contamination-free TIM​ features dielectric strength of 8kV/mm and volume resistivity of 10¹³ Ω·cm, providing effective electrical insulation alongside thermal management. Operating within -40°C to 125°C range, this ​non-silicone thermal pad​ carries UL94 V-0 certification and complies with international standards including RoHS, Halogen-Free, and REACH. The material's self-adhesive properties facilitate easy installation in applications such as fiber optic communications and hard disk drives where reliable thermal performance without contamination risks is essential. This ​basic non-silicone thermal pad​ is particularly suited for applications where lower thermal conductivity meets specific design requirements, ensuring cost-effectiveness and performance adequacy.