​AF Series Silicone-Free Thermal Pads | TOUSEN

The ​AF Series Silicone-Free Thermal Pads​ represent a breakthrough in ​non-silicone thermal interface materials, offering complete elimination of siloxane compounds and silicone oil bleed issues. These advanced ​silicone-free thermal pads​ deliver thermal conductivity from 1.0 to 8.0 W/m·K while providing exceptional electrical insulation and mechanical durability. The ​high-reliability electronics​ solution ensures zero risk of mirror fogging or electrical failures in sensitive applications, making it ideal for AI data centers, automotive sensors, and medical equipment where contamination-free operation is critical.

Technical Excellence and Application Advantages

The ​AF Series non-silicone TIM​ demonstrates outstanding performance in demanding environments with excellent tensile strength and abrasion resistance. With thermal impedance as low as 0.20°C·in²/W at 30psi for 1mm thickness, these ​silicone-free thermal pads​ provide efficient heat transfer while maintaining complete electrical isolation. Available in thicknesses from 0.25mm to 5.0mm with Shore 00 hardness of 50/70±5, this ​high-reliability electronics​ material offers customizable solutions for various design requirements. The self-adhesive properties facilitate easy installation and rework capability, while the UL94 V-0 certification ensures maximum safety in critical applications. Operating across wide temperature ranges and compliant with international standards including RoHS and REACH, the ​AF Series​ provides a contamination-free thermal management solution for fiber optic communications, industrial controls, and precision medical devices where reliability and performance are paramount.