AF500 General-Purpose Non-Silicone Thermal Pad | TOUSEN

The ​AF500 General-Purpose Non-Silicone Thermal Pad​ provides reliable 3.0W/mK thermal conductivity with a thermal impedance of 0.6°C·in²/W at 30psi. This ​standard electronics grade​ material offers balanced performance for applications requiring ​contamination-free thermal interface​ protection. The ​non-silicone thermal pad​ eliminates risks of siloxane volatilization and silicone oil bleeding, ensuring operational stability in sensitive equipment such as sensors and medical devices.

Technical Performance and Application Range

The ​AF500 general-purpose non-silicone thermal pad​ demonstrates consistent performance across data centers, automotive systems, and industrial controls. With thickness options from 0.5mm to 5.0mm and Shore 00 hardness of 50/70±8, this ​standard electronics grade​ material accommodates various assembly requirements while maintaining 70% elongation and 55psi tensile strength. The ​contamination-free TIM​ features dielectric strength of 8kV/mm and volume resistivity of 10¹³ Ω·cm, providing electrical insulation alongside thermal management. Operating within -40°C to 125°C range, this ​non-silicone thermal pad​ carries UL94 V-0 certification and complies with RoHS, Halogen-Free, and REACH standards. The material's self-adhesive properties facilitate installation in applications including fiber optic communications and AI devices where reliable thermal performance without contamination risks is essential.