​SF1000 High-Performance Thermal Conductive Pad | TOUSEN

The SF1000 High-Performance Thermal Pad delivers 10.0W/mK thermal conductivity with 0.18°C·in²/W impedance at 30psi, designed for demanding power electronics and high-density computing applications. This advanced thermal interface material effectively fills air gaps between heat-generating components and cooling systems, ensuring efficient heat transfer in compact spaces. With thickness options from 0.5mm to 5.0mm and customizable hardness (Shore 00 30-80), the SF1000 thermal pad adapts to various assembly requirements while protecting sensitive components.

Ideal for server memory modules, power supply units, and automotive control systems, the SF1000 maintains reliable performance across -50°C to 200°C. The material provides excellent electrical insulation (>6kV/mm dielectric strength) and complies with UL94 V-0 flame retardancy standards. Its self-adhesive properties facilitate installation in complex layouts, while low silicone oil bleed characteristics ensure equipment protection. This thermal management solution supports custom die-cutting for applications including SSD thermal management, PCB heat dissipation, and industrial power electronics.