SF500G Silicone Thermal Pad
SF500G
SF500G thermal conductive silica gel sheet can be very soft and well compressed, and is used to fill the interface of two items, so that the air in the interface is discharged and the heat conduction efficiency is improved. The product is self-adhesive and can be die-cut into various shapes for easy assembly. The thermal conductivity is 3.5W/(m·K).
Quantity:
Product Description
The TOUSEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.15 to 15.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K.
◆ Available in various thicknesses from 0.15 to 15.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【Applications】
◆ Electric Vehicle Battery Management System
◆ CPU/GPU Chips
◆ Capacitors
◆ Memory/VRAM particles
◆ Control boards
◆ Splitters
◆ Relays
◆ CPU/GPU Chips
◆ Capacitors
◆ Memory/VRAM particles
◆ Control boards
◆ Splitters
◆ Relays
Properties
| Properties | SF500G | Test Method |
|---|---|---|
| Color | Light Gray | Visual |
| Thickness | 0.3~10.0mm | ASTMD374 |
| density | 3.0g/cm3 | ASTMD792 |
| Thermal Conductivity | 3.5W/(m·K) | ASTMD5470 |
| Standard Hardness(Shore 00) | 40/60 | ASTMD2240 |
| Custom hardness(Shore 00) | 20~90 | ASTMD2240 |
| Elongation | 30% | ASTMD412 |
| Tensile strength | 30psi | ASTMD412 |
Resistance level | V-0 | UL94 |
| Operating Temperature | -50~200℃ | *** |
| Dielectric Strength@AC | >8KV/mm | ASTMD149 |
| Thermal Resistance(@30psi, 1mm) | 0.45℃·in2/W | ASTMD5470 |
ROHS | PASS | IEC62321 |
Halogen | PASS | EN14582 |
| REACH | PASS | EN14372 |
【Product Specifications】
200*300 mm or die-cut parts【Storage & Transportation】
Store in a well-ventilated, cool, and dry place, away from open flames.This product is non-toxic and should be stored and transported as a non-hazardous material.
【Packaging】
Customized packaging according to customer requirements.【Shelf Life】
24 months