ATD606FG Double-Sided Heat Sink Adhesive tape | TOUSEN
ATD606FG
The ATD606FG Thermal Conductive Double-Sided Tape is an advanced adhesive solution designed for bonding heat sinks to microprocessors and power semiconductors in electronic devices. This double-sided thermal tape features a thermal conductivity of 0.8 W/m·K and a thin profile of 0.15mm thickness, providing low thermal impedance for efficient heat transfer from components to cooling systems. With acrylic-based adhesive technology, it offers strong bonding performance with 180° peel strength of 1.5 KG/inch and excellent holding power exceeding 48 hours at 80°C.
This heat sink adhesive tape operates reliably across a temperature range of -40°C to 120°C, ensuring consistent performance in various environmental conditions. The tape demonstrates high electrical insulation properties with breakdown voltage of 3000 V/mm and volume resistivity ensuring safe operation in electronic applications. Its white color and substrate-free construction make it ideal for applications requiring minimal thickness and high reliability. The thermal conductive double-sided tape is ROHS compliant and meets industry standards for electronic manufacturing.
Applications include electronics assembly, printing equipment, LED lighting systems, and hardware components where secure thermal bonding is essential. The double-sided thermal tape simplifies installation by eliminating the need for mechanical fasteners or liquid adhesives, reducing assembly time and costs. It can be custom die-cut into specific shapes to accommodate various design requirements, offering flexibility in production processes.
The heat sink adhesive provides a clean and efficient solution for thermal management, serving as an alternative to traditional mounting methods such as screws or thermal pastes. Its easy application and removal facilitate maintenance and rework procedures. This thermal conductive tape is particularly suitable for high-volume manufacturing environments due to its consistent performance, ease of use, an
This heat sink adhesive tape operates reliably across a temperature range of -40°C to 120°C, ensuring consistent performance in various environmental conditions. The tape demonstrates high electrical insulation properties with breakdown voltage of 3000 V/mm and volume resistivity ensuring safe operation in electronic applications. Its white color and substrate-free construction make it ideal for applications requiring minimal thickness and high reliability. The thermal conductive double-sided tape is ROHS compliant and meets industry standards for electronic manufacturing.
Applications include electronics assembly, printing equipment, LED lighting systems, and hardware components where secure thermal bonding is essential. The double-sided thermal tape simplifies installation by eliminating the need for mechanical fasteners or liquid adhesives, reducing assembly time and costs. It can be custom die-cut into specific shapes to accommodate various design requirements, offering flexibility in production processes.
The heat sink adhesive provides a clean and efficient solution for thermal management, serving as an alternative to traditional mounting methods such as screws or thermal pastes. Its easy application and removal facilitate maintenance and rework procedures. This thermal conductive tape is particularly suitable for high-volume manufacturing environments due to its consistent performance, ease of use, an
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Product Description
Thermal Conductive Double-sided Tape are renowned for their distinctive characteristics, which include:
◆ Extremely thin thickness, extremely low thermal impedance, effectively and quickly directing heat flow to the heat dissipation system.
◆ Double sided adhesive form, strong adhesion, good insulation, and very convenient to use.
◆ Cut and punch according to customer needs into label or sticker forms.
◆ Fast processing, high yield, fast efficiency, no need to use thermal conductive adhesive for waiting and drying time.
◆ Suitable for products with special processing methods or environments that cannot use fluid thermal conductive materials.
◆ Convenient and easy to store, no special environment required, and easy to remove glue during subsequent maintenance, repair, or reprocessing of finished products.
◆ Can replace hot melt adhesive, screws, fasteners, and other fixing methods.
◆ Extremely thin thickness, extremely low thermal impedance, effectively and quickly directing heat flow to the heat dissipation system.
◆ Double sided adhesive form, strong adhesion, good insulation, and very convenient to use.
◆ Cut and punch according to customer needs into label or sticker forms.
◆ Fast processing, high yield, fast efficiency, no need to use thermal conductive adhesive for waiting and drying time.
◆ Suitable for products with special processing methods or environments that cannot use fluid thermal conductive materials.
◆ Convenient and easy to store, no special environment required, and easy to remove glue during subsequent maintenance, repair, or reprocessing of finished products.
◆ Can replace hot melt adhesive, screws, fasteners, and other fixing methods.
【Applications】
◆Electronics Industry
◆Printing industry
◆LED Lighting industry
◆Hardware Industry
◆Printing industry
◆LED Lighting industry
◆Hardware Industry
Properties
| Project | Unit | Test Method | Parameter |
|---|---|---|---|
| Color | / | Visual | White |
| No Substrate Thickness | mm | ASTM-D374 | 0.15 |
| Base Material | / | / | Not/fiberglass/PI/Aluminum foil |
| An Adhesive | / | / | Acrylic ester(acrylic) |
| Thermal Conductivity | W/m·k | ASTM-D5470 | 0.8 |
| Breakdown Voltage | V/mm | ASTM-D149 | 3000 |
| 180℃ peel Strength | KG/inch | PSTC-1 | 1.5KG |
| Holding Force 80℃ | / | PSTC-1 | >48hours |
| Temperature Resistance | ℃ | / | -40 to +120 |
Note: The above performance data is typical data tested at 70% and 25 ℃ for this product, and is for customer reference only. We cannot guarantee that all data can be achieved in a specific environment. Please refer to the measured data when using this product. We recommend that users conduct usability tests before use to prevent adverse consequences caused by unsuitable situations. Our company reserves the right to interpret the product.
