SF1200 Ultra-High Performance Thermal Pad | TOUSEN

The SF1200 Ultra-High Performance Thermal Pad delivers exceptional thermal management with 12.0W/mK conductivity and 0.15°C·in²/W impedance at 30psi, designed for the most demanding high-power computing applications. This premium thermal interface material provides superior heat dissipation in AI servers, data centers, and high-performance computing systems where thermal management is critical. With enhanced thermal transfer capabilities, the SF1200 effectively eliminates air gaps between processors and cooling systems, maintaining optimal operating temperatures under extreme workloads.

Engineered for next-generation computing infrastructure, the SF1200 thermal pad operates reliably across -50°C to 200°C. The material features a balanced hardness profile (Shore 00 30-80) and thickness options from 0.8mm to 5.0mm, ensuring perfect compatibility with various component configurations. Excellent electrical insulation (>6kV/mm dielectric strength) and UL94 V-0 certification provide essential safety for sensitive server components. This advanced cooling solution supports custom die-cutting for precise application in GPU clusters, CPU arrays, and high-density server configurations, offering reliable thermal management for cutting-edge computational platforms.