SE800AB Two-Part Thermal Gel | 8.0W/mK Curable Thermal Putty | TOUSEN

SE800AB
The ​SE800AB Two-Part Thermal Gel​ represents an advanced ​curable thermal putty​ solution that combines excellent thermal conductivity with mechanical protection capabilities. This innovative ​two-part thermal gel​ features a unique formulation that cures into a durable elastomer, providing both efficient heat transfer (8.0 W/m·K) and reliable shock absorption for sensitive electronic components. The ​curable thermal putty​ undergoes a controlled curing process at room temperature, achieving tack-free status in 30 minutes and full cure within 4 hours, forming a permanent elastic interface that maintains consistent thickness under various conditions.

Technical Performance and Application Advantages

The ​SE800AB two-part thermal gel​ demonstrates exceptional versatility in demanding applications including high-power processors, automotive electronics, and LED lighting systems. This advanced ​curable thermal putty​ offers superior performance compared to traditional thermal pads, with the added benefit of being rework-friendly while maintaining excellent dielectric strength (>6 kV/mm). The material's Shore 00 hardness of 55±10 after curing ensures optimal contact pressure without damaging delicate components. With its UL94 V-0 flame rating and compliance with RoHS, Halogen-Free, and REACH standards, this ​two-part thermal gel​ provides reliable thermal management for power supply units, gaming consoles, and engine control units where both thermal performance and mechanical protection are critical requirements.
Quantity:
Free Sample
Product Description

◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.  
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.  
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.  
◆ Excellent flame resistance, achieving a UL94 V-0 rating.  
◆ Curing time adjustable based on temperature.  
◆ Two-component structure for easy storage.  
◆ Can be precisely controlled for thickness and shape using automated equipment.  
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.  
 

【Applications】

◆ CPUs and GPUs  
◆ Power Supply Units (PSUs)  
◆ LED Modules  
◆ Engine Control Units (ECUs)  
◆ Gaming Consoles and Laptops  
 
Properties
 
Characteristic Parameter
PropertiesUnitSE800ABTest Method
Thermal ConductivityW/m·K8.0ASTM D5470
Flow Rate(@50cc,90psi)g/min10±5-
Color Before Curing-Part A: White
Part B: Gray
Visual
Densityg/cc3.2Helium Pycnometry
Mix Ratio-1:1-
Color After Curing-GrayVisual
Hardness After CuringShore 0055±10ASTM D2240
Tack-Free Time (@25℃)min30-
Full Cure Time (@25℃)h4-
Full Cure Time (@100℃)min15-
Minimum Interface Thicknessmm0.17-
Shelf Life (@25℃)months6-
Operating Temp.-50 ~ 150-
Dielectric Strength (@AC)kV/mm>6ASTM D149
Dielectric Constant (@1MHz)-7.5ASTM D150
Volume ResistivityΩ·cm>1014ASTM D257
Coefficient of Thermal Expansionppm/K175ASTM E831
Flame Rating-V-0UL94
RoHS-PASSIEC 62321
Halogen-PASSEN 14582
REACH-PASSEN 14372

【Storage & Transportation】

  Store in a well-ventilated, cool, and dry place, away from open flames.
  This product is non-toxic and should be stored and transported as a non-hazardous material.
 

【Packaging】

  ● 50cc ● 400cc
 

【Shelf Life】

   6 months