US Series Thermal Potting Compounds | TOUSEN
US Series
The US Series Thermal Potting Compounds provide reliable thermal management and environmental protection for electronic assemblies through two-component liquid encapsulation technology. This product line offers thermal conductivity options ranging from 1.0 to 3.0 W/m·K, with viscosity variations from 2,500 to 15,000 cPs to accommodate different application requirements. These compounds deliver excellent electrical insulation with dielectric constants between 4.5-7.0 at 1MHz, ensuring operational safety in diverse electronic environments.
These thermal potting materials feature precise 1:1 mass mixing ratios and uniform density characteristics, facilitating consistent application and reliable curing performance. The compounds maintain stability across wide temperature ranges, providing durable protection against moisture, dust, chemicals, and mechanical vibration. Their electrical insulation properties prevent short circuits between components while effectively transferring heat from heat-generating elements to enclosures or heat sinks.
Applications include LED drivers, power supplies, automotive ECUs, battery management systems, and industrial controllers where both thermal management and environmental protection are critical. The materials are particularly suitable for automotive electronics, industrial equipment, and new energy systems requiring resistance to vibration, temperature fluctuations, and harsh operating conditions.
The US Series compounds cure to form permanent protective barriers that enhance the longevity and reliability of electronic assemblies. With options ranging from lower viscosity formulations for intricate components to higher viscosity versions for structural applications, this product line offers tailored solutions for various potting and encapsulation requirements in electronic manufacturing.
These thermal potting materials feature precise 1:1 mass mixing ratios and uniform density characteristics, facilitating consistent application and reliable curing performance. The compounds maintain stability across wide temperature ranges, providing durable protection against moisture, dust, chemicals, and mechanical vibration. Their electrical insulation properties prevent short circuits between components while effectively transferring heat from heat-generating elements to enclosures or heat sinks.
Applications include LED drivers, power supplies, automotive ECUs, battery management systems, and industrial controllers where both thermal management and environmental protection are critical. The materials are particularly suitable for automotive electronics, industrial equipment, and new energy systems requiring resistance to vibration, temperature fluctuations, and harsh operating conditions.
The US Series compounds cure to form permanent protective barriers that enhance the longevity and reliability of electronic assemblies. With options ranging from lower viscosity formulations for intricate components to higher viscosity versions for structural applications, this product line offers tailored solutions for various potting and encapsulation requirements in electronic manufacturing.
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Product Description
US Series Thermal Potting Compounds are renowned for their distinctive characteristics, which include:
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
【Applications】
◆Electronic Components: Used in LED drivers, power supplies, and integrated circuits (ICs) to dissipate heat and shield against humidity/dust.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
Properties
| Properties | Color | Viscosity | Density | Before Mixing(Test Environment: 25℃; Relative Humility: 55%) | Performance After Curing(Test Environment: 25℃; Relative Humility: 55%) | ||
|---|---|---|---|---|---|---|---|
| Mass Ratio | Mixed Viscosity | Dielectric Constant | Thermal Conductivity | ||||
| Unit | - | cPs | g/cm3 | - | cPs | 1MHz | W/m·k |
A: White B:Gray | 2500 ~ 3000 | A: 2.2±0.1 B: 2.2±0.1 | 1:1 | 2500 ~ 3000 | ≤4.5 | 1.0 | |
A: White B:Gray | 4000 ~ 4500 | A: 2.5±0.1 B: 2.5±0.1 | 1:1 | 4000 ~ 4500 | ≤5.0 | 1.5 | |
A: White B:Gray | 6000 ~ 6500 | A: 2.6±0.1 B: 2.6±0.1 | 1:1 | 6000 ~ 6500 | ≤5.5 | 2.0 | |
A: White B:Gray | 8000 ~ 8500 | A: 2.75±0.1 B: 2.75±0.1 | 1:1 | 8000 ~ 8500 | ≤6.5 | 2.5 | |
A: White B:Gray | 14000 ~ 15000 | A: 2.8±0.1 B: 2.8±0.1 | 1:1 | 14000 ~ 15000 | ≤7.0 | 3.0 | |
