SE Series Thermal Gel (2.0-10.0W/m·K) | One-Component Thermal Putty | TOUSEN

The ​SE Series Thermal Gel​ represents a comprehensive range of high-performance ​one-component thermal interface materials​ designed for diverse electronic cooling applications. This advanced ​thermal gel series​ offers thermal conductivity options from 2.0W/m·K to 10.0W/m·K, providing engineers with flexible solutions for various power density requirements. The ​SE series thermal putty​ features silicone resin-based formulations that ensure excellent gap-filling capabilities between heat-generating components and heat sinks. As a complete ​thermal gel​ portfolio, this series combines ease of application with consistent thermal management performance across all available grades.

Technical Performance and Application Advantages

The ​SE Series Thermal Gel​ demonstrates exceptional versatility in applications ranging from consumer electronics to automotive systems. This ​one-component thermal interface material​ series maintains low thermal impedance values (0.045-0.1°C·in²/W) across all conductivity grades, ensuring efficient heat transfer in various operating conditions. The ​thermal gel series​ features excellent extrusion properties for automated dispensing, allowing precise thickness control from 0.1mm minimum interface thickness. With UL94 V-0 flame resistance certification and compliance with RoHS, Halogen-Free, and REACH standards, this ​SE series thermal putty​ guarantees safety and reliability in sensitive electronic applications. The materials maintain stable performance across -40°C to 150°C temperature ranges, making the entire ​thermal gel​ series suitable for CPUs, GPUs, power supply units, LED modules, and automotive electronic systems where consistent thermal management is critical.