TSAD60-2 Thermal Paste

    TSAD60-2
    TOUSEN thermally conductive compounds are grease like materials that are highly loadedwith thermally conductive fillers in a silicone matrix. This combination promotes high thermalconductivity, low bleed and high-temperature stability. The compounds are designed tomaintain a positive heat sink seal to improve heat transfer from an electrical device or PCBsystem assembly to a heat sink or chassis, thereby increasing the overall efficiency of thedevice. PCB system assemblies are continually designed to deliver higher performance.
    Quantity:
    Free Sample
    Product Description
     
    Thermally Conductive Paste are renowned for their distinctive characteristics, which include: 
    ◆Gray, thixotropic, non-curing thermally conductive compound.  
    ◆One part material - no cure required.  
    ◆Solvent free formulation - provides material stability.  
    ◆Easy application -Screen printable.  
    ◆Thixotropic - low slump.  
    ◆High thermal conductivity.  
    ◆Achieves thin Bond Line Thickness (BLT).  
    ◆Low thermal resistance.  
     

    【Applications】

    ◆ CPUs and GPUs  
    ◆ Power Supply Units (PSUs)  
    ◆ LED Modules  
    ◆ Engine Control Units (ECUs)  
    ◆ Gaming Consoles and Laptops  
     
     
    Properties
     
    Characteristic Parameter TSAD60-2
    ProductTSAD60 Thermally Conductive Paste
    colourGray
    Specifc Gravity<2.6
    Evaporation<0.001
    Bleed<0.05
    Dielectric Constant>5.1
    Dissipation Factor<0.005
    Viscosity85
    Thixotropic Index380±10
    Thermal Conductivity>3.5
    Thermal lmpedance<0.006
     

    【Storage & Transportation】

      Store in a well-ventilated, cool, and dry place, away from open flames.
      This product is non-toxic and should be stored and transported as a non-hazardous material.
     

    【Packaging】

      Customized packaging according to customer requirements.
     

    【Shelf Life】

      12 months