SF700 High-Performance Thermal Pad | TOUSEN

The SF700 High-Performance Thermal Pad delivers exceptional thermal management with 7.0W/mK conductivity and 0.25°C·in²/W impedance at 30psi, designed for demanding electronic applications requiring efficient heat dissipation. This advanced thermal interface material effectively fills air gaps between components and heat sinks, ensuring optimal thermal transfer in high-power density environments. With a thickness range of 0.5mm to 5.0mm and customizable hardness (Shore 00 30-90), the SF700 thermal pad adapts to various assembly configurations while protecting sensitive components from mechanical stress.

Ideal for advanced computing systems, automotive electronics, and high-frequency communication devices, the SF700 maintains reliable performance across -50°C to 200°C. The material provides excellent electrical insulation (>6kV/mm dielectric strength) and complies with UL94 V-0 flame retardancy standards. Its self-adhesive properties facilitate easy installation and rework, while low silicone oil bleed characteristics ensure minimal impact on equipment. This thermal management solution supports custom die-cutting for precise application in SSD cooling, PCB thermal management, and drone electronics, offering a robust cooling solution for next-generation technologies.