SE80 Thermal Gel 8.0W/mK | One-Component Thermal Putty | TOUSEN

The ​SE80 Thermal Gel​ represents an advanced ​one-component thermal putty​ solution delivering high-performance thermal management with 8.0 W/m·K conductivity. This innovative ​thermal gel​ combines exceptional heat transfer capabilities with the application convenience of a single-component system, requiring no mixing or curing processes. The silicone resin-based formulation ensures excellent gap-filling properties, effectively transferring heat from electronic components to heat sinks while maintaining low thermal impedance (0.05°C·in²/W). As a versatile ​thermal putty, this material provides optimal performance in various gap thicknesses and complex assembly configurations.

Technical Performance and Application Advantages

The ​SE80 thermal gel​ demonstrates outstanding reliability in demanding applications including CPUs, GPUs, and power supply units. This ​one-component thermal putty​ features minimal oil bleeding and excellent extrusion properties, allowing precise application through automated dispensing equipment. The material's soft, compressible nature ensures low assembly stress on delicate components while providing excellent surface wetting. With dielectric strength exceeding 6000 V/mm and volume resistance >10¹⁴ Ω·cm, this ​thermal gel​ offers both thermal management and electrical insulation benefits. The ​SE80 one-component thermal putty​ maintains stable performance across -50°C to 150°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, making it suitable for automotive electronics, LED modules, and consumer electronics applications where reliability and safety are paramount.