​SE20 Thermal Gel 2.0W/mK | Single-Part Thermal Putty | TOUSEN

The ​SE20 Thermal Gel​ is an economical ​single-part thermal putty​ delivering reliable 2.0 W/m·K thermal conductivity for basic electronic cooling applications. This cost-effective ​thermal gel​ utilizes a silicone resin-based formulation that provides essential gap-filling performance between heat-generating components and heat sinks. As a practical ​thermal putty, the material offers fundamental thermal management capabilities with minimal oil separation, ensuring stable performance in standard operating conditions. The ​SE20 thermal gel​ combines straightforward application with consistent thermal performance, making it an ideal entry-level solution for general electronic cooling requirements.

Technical Performance and Application Advantages

The ​SE20 thermal putty​ demonstrates adequate performance in basic applications including consumer electronics and LED modules. This ​single-part thermal putty​ features efficient extrusion properties (80±15 g/min) and can be easily applied using standard dispensing equipment. The material's compliant nature ensures minimal stress on components while maintaining basic surface contact. With dielectric strength exceeding 2000 V/mm and volume resistance >10¹² Ω·cm, this ​thermal gel​ provides both basic thermal management and electrical insulation benefits. The ​SE20 thermal putty​ maintains stable performance across -40°C to 150°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, making it suitable for consumer electronics, basic LED applications, and general industrial uses where reliable thermal performance and safety are fundamental requirements.