Polyimide Tape-75100 | TOUSEN
Polyimide tape-75100
The Polyimide Tape-75100 is a high-temperature Kapton tape designed for demanding SMT process applications requiring reliable thermal and electrical performance. This polyimide tape features a polyimide film backing with silicone adhesive, providing a total thickness of 0.175mm (0.075mm backing ±0.002mm and 0.10mm adhesive ±0.002mm). The tape withstands temperatures up to 260°C for 30 minutes while maintaining excellent adhesion and electrical insulation properties.
This high-temperature Kapton tape demonstrates strong adhesion of 400±50 gf/25mm and tensile strength of 250MPa, ensuring secure bonding during SMT manufacturing processes. With elongation of 100% and initial tack of 10# ball down, the polyimide tape offers flexibility and reliable initial contact. The dielectric breakdown strength of 5.5kV provides effective electrical insulation for sensitive electronic components. The amber-colored tape exhibits solvent resistance and leaves no residual adhesive upon removal.
Applications include SMT process temperature measurement where the polyimide tape secures thermocouple wires during reflow oven profiling. In flexible circuit board assembly, it attaches FPCs to fixtures for printing, mounting, and testing operations. The Kapton tape also serves as insulation wrap for cables and as surface mount machine material extraction aid for connectors. With a six-month shelf life under recommended storage conditions (23°C, 65% RH), this SMT process tape ensures reliability in electronic manufacturing environments requiring high-temperature resistance and electrical protection.
The polyimide tape's combination of thermal stability and electrical insulation makes it suitable for applications demanding both heat resistance and dielectric performance. Its strong holding force and clean removal characteristics provide practical solutions for temporary fixturing and permanent insulation in electronic assembly processes.
This high-temperature Kapton tape demonstrates strong adhesion of 400±50 gf/25mm and tensile strength of 250MPa, ensuring secure bonding during SMT manufacturing processes. With elongation of 100% and initial tack of 10# ball down, the polyimide tape offers flexibility and reliable initial contact. The dielectric breakdown strength of 5.5kV provides effective electrical insulation for sensitive electronic components. The amber-colored tape exhibits solvent resistance and leaves no residual adhesive upon removal.
Applications include SMT process temperature measurement where the polyimide tape secures thermocouple wires during reflow oven profiling. In flexible circuit board assembly, it attaches FPCs to fixtures for printing, mounting, and testing operations. The Kapton tape also serves as insulation wrap for cables and as surface mount machine material extraction aid for connectors. With a six-month shelf life under recommended storage conditions (23°C, 65% RH), this SMT process tape ensures reliability in electronic manufacturing environments requiring high-temperature resistance and electrical protection.
The polyimide tape's combination of thermal stability and electrical insulation makes it suitable for applications demanding both heat resistance and dielectric performance. Its strong holding force and clean removal characteristics provide practical solutions for temporary fixturing and permanent insulation in electronic assembly processes.
Quantity:
Usages
◆During SMT process, when measuring the temperature of the reflow oven, stick thermocouple wires.
◆In the SMT process, it is used to paste flexible circuit boards (FPCs) onto fixtures for a series of processes such as printing, mounting, and testing.
◆Can be wrapped on top of cables as insulation tape.
◆Can be attached to connectors for material extraction by surface mount machines, replacing iron sheets.
Properties
| Item | Unit | SPEC.VALUES | Test Method |
|---|---|---|---|
BACKING | / | Polyimide film | / |
THICKNESS | mm | 0.075±0.002 | GB/T 13542.2-2009 |
COLOR | / | Amber | / |
GLUE | / | Silicone | / |
THICKNESS | mm | 0.10±0.002 | GB/T 7125-2014 |
ADHESION | gf/25mm | 400±50 | GB/T 2792-2014 |
INITIAL TACK | NO.Ball | 10#↓ | GB/T 4852-2002 |
TENSILE STRENGTH | Mpa | 250↓ | GB/T 30776-2014 |
ELONGATION | % | 100↓ | GB/T 30776-2014 |
HEAT RESISTANCE | 260℃/30min | PASS | / |
DIELECTRIC BREAKDOWN | Kv | 5.5↓ | GB/T 1408.1-2006 |
Retention period | SIX MONTHS | ||
Save environment | Suggested preservation condition 23℃,65%Rh. Be well venilated desiccation avoid adylight. | ||