Polyimide Tape-75100 | TOUSEN

Polyimide tape-75100
The Polyimide Tape-75100 is a high-temperature Kapton tape designed for demanding SMT process applications requiring reliable thermal and electrical performance. This polyimide tape features a polyimide film backing with silicone adhesive, providing a total thickness of 0.175mm (0.075mm backing ±0.002mm and 0.10mm adhesive ±0.002mm). The tape withstands temperatures up to 260°C for 30 minutes while maintaining excellent adhesion and electrical insulation properties.

This high-temperature Kapton tape demonstrates strong adhesion of 400±50 gf/25mm and tensile strength of 250MPa, ensuring secure bonding during SMT manufacturing processes. With elongation of 100% and initial tack of 10# ball down, the polyimide tape offers flexibility and reliable initial contact. The dielectric breakdown strength of 5.5kV provides effective electrical insulation for sensitive electronic components. The amber-colored tape exhibits solvent resistance and leaves no residual adhesive upon removal.

Applications include SMT process temperature measurement where the polyimide tape secures thermocouple wires during reflow oven profiling. In flexible circuit board assembly, it attaches FPCs to fixtures for printing, mounting, and testing operations. The Kapton tape also serves as insulation wrap for cables and as surface mount machine material extraction aid for connectors. With a six-month shelf life under recommended storage conditions (23°C, 65% RH), this SMT process tape ensures reliability in electronic manufacturing environments requiring high-temperature resistance and electrical protection.

The polyimide tape's combination of thermal stability and electrical insulation makes it suitable for applications demanding both heat resistance and dielectric performance. Its strong holding force and clean removal characteristics provide practical solutions for temporary fixturing and permanent insulation in electronic assembly processes.
Quantity:
Free Sample
Usages

During SMT process, when measuring the temperature of the reflow oven, stick thermocouple wires.
In the SMT process, it is used to paste flexible circuit boards (FPCs) onto fixtures for a series of processes such as printing, mounting, and testing.
Can be wrapped on top of cables as insulation tape.
Can be attached to connectors for material extraction by surface mount machines, replacing iron sheets.

 
 
Properties
 
Characteristic Parameter
ItemUnitSPEC.VALUESTest Method
BACKING
/
Polyimide film
/
THICKNESS
mm
0.075±0.002
GB/T 13542.2-2009
COLOR
/
Amber
/
GLUE
/
Silicone
/
THICKNESS
mm
0.10±0.002
GB/T 7125-2014
ADHESION
gf/25mm
400±50
GB/T 2792-2014
INITIAL TACK
NO.Ball
10#↓
GB/T 4852-2002
TENSILE STRENGTH
Mpa
250↓
GB/T 30776-2014
ELONGATION
%
100↓
GB/T 30776-2014
HEAT RESISTANCE
260℃/30min
PASS
/
DIELECTRIC BREAKDOWN
Kv
5.5↓
GB/T 1408.1-2006
Retention period
SIX MONTHS
Save environment
Suggested preservation condition 23℃,65%Rh.
Be well venilated desiccation avoid adylight.