Polyimide Tape-2535 | High-Temp Kapton Tape | TOUSEN
Polyimide tape-2535
The Polyimide Tape-2535 is a high-temperature Kapton tape designed for demanding SMT process applications requiring reliable thermal and electrical performance. This polyimide tape features a polyimide film backing with silicone adhesive, providing a total thickness of 0.060mm (0.025mm backing ±0.002mm and 0.035mm adhesive ±0.002mm). The tape withstands temperatures up to 260°C for 30 minutes while maintaining excellent adhesion and electrical insulation properties. With adhesion strength of 400±50 gf/25mm, tensile strength of 150MPa, and elongation of 100%, this high-temperature tape offers durable bonding and flexibility for various surfaces.
This SMT process tape demonstrates strong initial tack of 18# ball down and dielectric breakdown strength of 4.5kV, ensuring secure bonding and effective electrical insulation for sensitive components. The amber-colored tape exhibits solvent resistance and leaves no residual adhesive upon removal, making it suitable for both temporary fixturing and permanent insulation. With a six-month shelf life under recommended storage conditions (23°C, 65% RH), this polyimide tape ensures reliability in electronic manufacturing environments.
Applications include SMT process temperature measurement where the high-temperature Kapton tape secures thermocouple wires during reflow oven profiling. In flexible circuit board assembly, it attaches FPCs to fixtures for printing, mounting, and testing operations. The tape also serves as insulation wrap for cables and as surface mount machine material extraction aid for connectors, replacing iron sheets. This SMT process tape is ideal for electronic applications requiring heat resistance and dielectric performance.
This SMT process tape demonstrates strong initial tack of 18# ball down and dielectric breakdown strength of 4.5kV, ensuring secure bonding and effective electrical insulation for sensitive components. The amber-colored tape exhibits solvent resistance and leaves no residual adhesive upon removal, making it suitable for both temporary fixturing and permanent insulation. With a six-month shelf life under recommended storage conditions (23°C, 65% RH), this polyimide tape ensures reliability in electronic manufacturing environments.
Applications include SMT process temperature measurement where the high-temperature Kapton tape secures thermocouple wires during reflow oven profiling. In flexible circuit board assembly, it attaches FPCs to fixtures for printing, mounting, and testing operations. The tape also serves as insulation wrap for cables and as surface mount machine material extraction aid for connectors, replacing iron sheets. This SMT process tape is ideal for electronic applications requiring heat resistance and dielectric performance.
Quantity:
Usages
◆During SMT process, when measuring the temperature of the reflow oven, stick thermocouple wires.
◆In the SMT process, it is used to paste flexible circuit boards (FPCs) onto fixtures for a series of processes such as printing, mounting, and testing.
◆Can be wrapped on top of cables as insulation tape.
◆Can be attached to connectors for material extraction by surface mount machines, replacing iron sheets.
Properties
| Item | Unit | SPEC.VALUES | Test Method |
|---|---|---|---|
BACKING | / | Polyimide film | / |
THICKNESS | mm | 0.025±0.002 | GB/T 13542.2-2009 |
COLOR | / | Amber | / |
GLUE | / | Silicone | / |
THICKNESS | mm | 0.035±0.002 | GB/T 7125-2014 |
ADHESION | gf/25mm | 400±50 | GB/T 2792-2014 |
INITIAL TACK | NO.Ball | 18#↓ | GB/T 4852-2002 |
TENSILE STRENGTH | Mpa | 150↑ | GB/T 30776-2014 |
ELONGATION | % | 100↓ | GB/T 30776-2014 |
HEAT RESISTANCE | 260℃/30min | PASS | / |
DIELECTRIC BREAKDOWN | Kv | 4.5 | GB/T 1408.1-2006 |
Retention period | SIX MONTHS | ||
Save environment | Suggested preservation condition 23℃,65%Rh. Be well venilated desiccation avoid adylight. | ||