TSAD100 Thermal Grease | 6.5W/mK | TOUSEN

The ​TSAD100 Thermal Grease​ is a premium-grade ​non-curing thermal compound​ engineered to deliver exceptional thermal performance with 6.5W/m·K conductivity. This advanced ​thermal paste​ features a unique thixotropic formulation that maintains optimal viscosity while providing excellent heat transfer capabilities. The ​thermal grease​ is specifically designed as a single-component material requiring no curing process, ensuring immediate thermal performance upon application. With its highly loaded thermally conductive fillers in a silicone matrix, this ​non-curing thermal compound​ achieves minimal thermal resistance of 0.03°C·cm²/W at 60psi, making it ideal for high-power electronic applications.

Technical Performance and Application Advantages

The ​TSAD100 thermal paste​ demonstrates outstanding reliability in demanding thermal management applications including CPUs, GPUs, and power supply units. This advanced ​thermal grease​ exhibits exceptional stability with oil separation rate below 0.01% at 200°C for 96 hours, ensuring long-term performance consistency. The material's screen-printable characteristics and low slump properties make this ​non-curing thermal compound​ suitable for automated manufacturing processes. With volume resistivity of 1.7×10¹² Ω and specific gravity of 2.8g/cm³, the ​TSAD100 thermal paste​ provides reliable electrical insulation while maintaining efficient heat transfer. The product's 720-day shelf life at 25°C and solvent-free formulation guarantee material stability, making it an ideal choice for automotive electronics, LED modules, and high-performance computing applications where reliable thermal management is critical.