SE60 Thermal Gel 6.0W/mK | Single-Part Thermal Putty | TOUSEN

The ​SE60 Thermal Gel​ represents a high-performance ​single-part thermal putty​ solution delivering reliable 6.0 W/m·K thermal conductivity for diverse electronic applications. This innovative ​thermal gel​ combines effective heat transfer capabilities with the application convenience of a ready-to-use, no-mix formulation. The silicone-based ​thermal putty​ ensures excellent gap-filling performance, efficiently transferring heat from components to heat sinks while maintaining low thermal impedance (0.045°C·in²/W). As a versatile ​thermal gel, this material provides consistent performance across various assembly configurations and complex gap thicknesses.

Technical Performance and Application Advantages

The ​SE60 thermal gel​ demonstrates reliable performance in applications including CPUs, GPUs, and power supply units. This ​single-part thermal putty​ features minimal oil separation and excellent extrusion characteristics, enabling precise application through automated dispensing equipment. The material's soft, compressible nature ensures low stress on delicate components while providing optimal surface contact. With dielectric strength exceeding 8000 V/mm and volume resistance >10¹⁴ Ω·cm, this ​thermal gel​ offers both thermal management and electrical insulation benefits. The ​SE60 thermal putty​ maintains stable performance across -50°C to 150°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, making it suitable for consumer electronics, LED modules, and automotive applications where reliability and safety are essential requirements.