AF300 Standard Non-Silicone Thermal Pad | TOUSEN

The ​AF300 Standard Non-Silicone Thermal Pad​ provides reliable 2.0W/mK thermal conductivity with a thermal impedance of 0.8°C·in²/W at 30psi. This ​general electronics grade​ material offers balanced performance for applications requiring ​contamination-free thermal interface​ protection. The ​non-silicone thermal pad​ eliminates risks of siloxane volatilization and silicone oil bleeding, ensuring operational stability in various electronic equipment including sensors and control systems.

Technical Performance and Application Range

The ​AF300 standard non-silicone thermal pad​ demonstrates consistent performance across data centers, automotive systems, and industrial applications. With thickness options from 0.5mm to 5.0mm and Shore 00 hardness of 50/70±8, this ​general electronics grade​ material accommodates various assembly requirements while maintaining 70% elongation and 55psi tensile strength. The ​contamination-free TIM​ features dielectric strength of 8kV/mm and volume resistivity of 10¹³ Ω·cm, providing electrical insulation alongside thermal management. Operating within -40°C to 125°C range, this ​non-silicone thermal pad​ carries UL94 V-0 certification and complies with RoHS, Halogen-Free, and REACH standards. The material's self-adhesive properties facilitate installation in applications including fiber optic communications and medical devices where reliable thermal performance without contamination risks is required.