SF800 Advanced Electronics Cooling Solution | TOUSEN

The SF800 High-Efficiency Thermal Pad delivers superior thermal performance with 8.0W/mK conductivity and 0.22°C·in²/W impedance at 30psi, designed for high-power electronic applications requiring efficient heat dissipation. This advanced thermal interface material effectively fills air gaps between components and heat sinks, ensuring optimal thermal transfer in demanding environments. With a thickness range of 0.5mm to 5.0mm and customizable hardness (Shore 00 30-90), the SF800 thermal pad adapts to various assembly configurations while protecting sensitive components from mechanical stress.Ideal for high-performance computing systems, automotive electronics, and industrial power devices, the SF800 maintains reliable performance across -50°C to 200°C. The material provides excellent electrical insulation (>6kV/mm dielectric strength) and complies with UL94 V-0 flame retardancy standards. Its self-adhesive properties facilitate easy installation and rework, while low silicone oil bleed characteristics ensure minimal impact on equipment. This thermal management solution supports custom die-cutting for precise application in SSD cooling, PCB thermal management, and power supply units, offering a robust cooling solution for next-generation technologies.