Consumer Electronics Solutions
Intelligent mobile phone
Smartphone Hot Design Challenge:
-The power consumption of electronic components such as 5G chips has increased, and the demand for heat dissipation has expanded
-OLED and foldable screen applications require suitable thermal conductive materials to assist in heat dissipation
-Wireless charging applications have corresponding thermal management
-Mobile phone design is thinner and lighter, with a more centralized internal structure and difficult heat dissipation
| Thermal conductive silicone grease can be directly applied or steel mesh/screen printed on the surface of mobile phone chips to fill gaps and reduce temperature differences between electronic devices to maintain normal equipment operation. | |
| Thermal pads can be directly attached between the CPU chip and the heat sink or casing for heat transfer. Thermal pads have the characteristics of low hardness, high compression rate, and low compressive stress. They will not affect precision components such as chips during assembly and will not damage the chips. | |
| The thermal conductive gel can be used at the chip, which generates more heat, and the mobile phone chip is small in size, with many precision micro components inside. The thermal conductive gel presents a paste state, and the compression stress is low, which will not cause deformation of the micro components of the mobile phone. | |
| Carbon fiber thermal pads can be attached to the inside of OLED screens for heat dissipation. The directionality of the high thermal conductivity filler itself and its orientation arrangement in the matrix make the carbon fiber thermal conductivity gasket have lower filling and higher thermal conductivity, and excellent mechanical properties. Lightweight, good resilience, and low thermal resistance. |
Notebook computer
The internal space of a lightweight laptop is small, and the PC accessories and layout used are special. If it is equipped with a high-end processor and chip, the difficulty of heat dissipation will be greatly increased. Therefore, choosing a high-performance thermal conductive material is particularly important. The thermal interface materials that can be applied on laptops include:
| Thermal pads can fill the gaps between heating devices or the entire PCB board and metal shells or heat sinks, effectively transferring heat and ensuring the efficiency of heating electronic components. | |
| Thermal conductive silicone grease can fully wet the surface of the target component, forming a very low thermal resistance interface. So, under the same thermal conductivity, the thermal conductivity of thermal grease will be better. Through the combination of "fan heat pipe heat sink thermal grease", the CPU and graphics card on the motherboard dissipate heat through the heat sink. | |
| Thermal phase change film can be used for heat transfer between chips or graphics cards and heat sinks. When the phase transition temperature is reached, the thermally conductive phase change film transforms from a solid state to a liquid state and is used to fill the gap between the heating device and the heat sink, achieving low thermal resistance and forming a good thermal conductivity interface. |
Home gaming console
At present, there is a wide variety of games on the market with rich gameplay, which has led to an urgent need for performance upgrades of game consoles. From display clarity, high-quality audio output, to high-performance processors and graphics cards for processing game graphics and data. The performance upgrade of game consoles has brought higher heat dissipation requirements.
The thermal interface materials that can be applied to home game consoles include:
| Thermal conductive silicone grease can be used for heat dissipation on CPU chips. Can be directly applied or steel mesh/screen printed on the surface of the target device; It can fully wet the surface of the target component, forming a very low thermal resistance interface. | |
| The thermal conductive gel can fill the gap between the chip and the heat sink, improving the heat dissipation efficiency. The thermal conductive gel presents a paste state, which will not cause deformation of the internal micro devices of electronic products. |
Tablet PC
As the market demand for electronic products becomes increasingly lightweight, lightweight, and portable, tablet computers combine the functions of mobile phones and laptops, and the market demand for this product is growing day by day. Compared to smartphones, tablets have larger display screens and require high-performance processors for multifunctionality, leading to increased heat dissipation requirements.
| Thermal pads can fill the gaps between heating devices or the entire PCB board and metal shells or heat sinks, effectively transferring heat and ensuring the efficiency of heating electronic components. Its hardness, oil yield, volatility, carrier, and compression rate can be flexibly designed according to customer needs. | |
| Thermal conductive silicone grease is used in scenarios where high thermal conductivity and thin thickness are required. Can be applied to the gap between the CPU or graphics card and the heat sink to enhance thermal conductivity | |
| The minimum application gap of the thermal conductive gel can reach 0.05mm, and the thermal resistance is low, which can meet the high power cooling needs of the tablet computer 8-core chip. Mainly used to fill gaps and uneven holes on material surfaces, establish effective heat conduction channels between electronic components and heat sinks, reduce contact thermal resistance, and fully utilize the function of the heat sink. |
The power adapter
With the increasing multifunctionality, high integration, and miniaturization of electronic terminal products, there are also higher requirements for the required power supply. Power adapter, also known as external power supply, is a portable electronic device power supply voltage conversion device that can convert 220V high-voltage household AC power into low voltage of around 5V-40V. Power adapters are ubiquitous in daily life, and prolonged use can cause overheating and even affect the performance of electronic devices. Therefore, in order for the power adapter to provide stable current input for electronic devices, it is essential to choose a suitable thermal conductive material for effective heat dissipation of the power adapter.
| There are electronic components such as MOS tubes, transformers, and transistors on the power PCB, which are the main heat sources. Filling thermal pads between the heating devices and aluminum plate heat sinks can improve heat transfer efficiency. The thermal pad is soft and resilient, with good reliability and long service life. | |
| Thermal insulation film can be used between power MOS tube packaging and heat sink, and then screw the MOS tube and heat sink to improve heat dissipation efficiency. Thermal insulation film has excellent electrical insulation performance, which can effectively ensure the safe operation of power adapters. |
