US-5201-15 Thermal Potting Compound | 1.5W/mK | TOUSEN
US-5201-15
The US-5201-15 Thermal Potting Compound is a two-component liquid encapsulation material designed for electronic applications requiring enhanced thermal management capabilities. With a thermal conductivity of 1.5W/m·K and viscosity range of 4,000-4,500cPs, this potting compound provides improved heat dissipation while maintaining excellent electrical insulation properties. The material features a precise 1:1 mass mixing ratio and uniform density of 2.5±0.1g/cm³ for both components, ensuring consistent mixing and reliable curing performance.
This thermal potting material delivers robust dielectric performance with a dielectric constant ≤5.0 at 1MHz and volume resistivity >1×10¹² Ω·cm, providing enhanced electrical safety in demanding electronic assemblies. The compound offers comprehensive environmental protection against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for superior circuit protection. Its Shore A hardness of 20±5 after curing ensures adequate mechanical protection while maintaining flexibility.
Applications include power supplies, automotive control units, industrial sensors, and LED drivers where balanced thermal performance and environmental sealing are essential. The material's 60-minute operating time provides sufficient processing flexibility for complex encapsulation applications. With its medium viscosity characteristics, the US-5201-15 is particularly suitable for applications requiring better thermal conductivity than standard potting compounds while maintaining good flow characteristics.
The potting compound cures to form a permanent protective barrier that enhances the longevity and reliability of electronic assemblies in challenging operating environments. Its electrical insulation properties prevent short circuits while effectively managing heat generation in power electronics and control systems. The material maintains stability across wide temperature ranges, ensuring consistent perfor
This thermal potting material delivers robust dielectric performance with a dielectric constant ≤5.0 at 1MHz and volume resistivity >1×10¹² Ω·cm, providing enhanced electrical safety in demanding electronic assemblies. The compound offers comprehensive environmental protection against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for superior circuit protection. Its Shore A hardness of 20±5 after curing ensures adequate mechanical protection while maintaining flexibility.
Applications include power supplies, automotive control units, industrial sensors, and LED drivers where balanced thermal performance and environmental sealing are essential. The material's 60-minute operating time provides sufficient processing flexibility for complex encapsulation applications. With its medium viscosity characteristics, the US-5201-15 is particularly suitable for applications requiring better thermal conductivity than standard potting compounds while maintaining good flow characteristics.
The potting compound cures to form a permanent protective barrier that enhances the longevity and reliability of electronic assemblies in challenging operating environments. Its electrical insulation properties prevent short circuits while effectively managing heat generation in power electronics and control systems. The material maintains stability across wide temperature ranges, ensuring consistent perfor
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Product Description
US Series Thermal Potting Compounds are renowned for their distinctive characteristics, which include:
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
【Applications】
◆Electronic Components: Used in LED drivers, power supplies, and integrated circuits (ICs) to dissipate heat and shield against humidity/dust.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
Properties
| Item | Unit | US-5210-15 |
|---|---|---|
| Color | - | A: White B:Gray |
| Viscosity | cPs | 4000 ~ 4500 |
| Density | g/cm3 | A: 2.5±0.1 B: 2.5±0.1 |
| Before Mixing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Mass Ratio | - | 1:1 |
| Mixed Viscosity | cPs | 4000 ~ 4500 |
| Operating Time | min | 60 |
| Performance After Curing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Hardness | Shore A | 20±5 |
| Dielectric Strength | kV/mm | >10 |
| Volume Resistance | Ω·cm | >1*1012 |
| Dielectric Constant | 1MHz | ≤5.0 |
| Thermal Conductivity | W/m·k | 1.5 |
