US-5201-30 High-Performance Thermal Potting Compound | 3.0W/mK | TOUSEN
US-5201-30
The US-5201-30 Thermal Potting Compound represents the highest performance level in the US Series, delivering 3.0W/mK thermal conductivity for demanding electronic applications requiring superior heat dissipation. With a viscosity range of 14,000-15,000cPs, this two-component encapsulation material provides optimal flow characteristics for complex potting applications while maintaining excellent thermal transfer capabilities. The compound features a precise 1:1 mass mixing ratio and consistent density of 2.8±0.1g/cm³ for both components, ensuring reliable processing and curing performance.
This high-performance potting material offers enhanced dielectric properties with a dielectric constant ≤7.0 at 1MHz and volume resistivity >1×10¹² Ω·cm, providing robust electrical insulation in power-intensive applications. The material delivers comprehensive environmental protection against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for advanced circuit protection. Its Shore A hardness of 20±5 after curing balances mechanical protection with necessary flexibility for various industrial applications.
Applications include high-power LED systems, automotive power control units, industrial motor drives, and energy storage systems where maximum thermal performance is critical. The material's 60-minute operating time allows sufficient processing window for intricate encapsulation procedures. With the highest viscosity in the US Series, the US-5201-30 is particularly suited for applications requiring both superior thermal conductivity and structural stability in challenging environments.
The potting compound cures to form a durable protective barrier that enhances the reliability of electronic assemblies operating under extreme thermal conditions. Its combination of maximum thermal conductivity and reliable electrical insulation makes it ideal for high-power electronic applications where efficient heat management and electrical s
This high-performance potting material offers enhanced dielectric properties with a dielectric constant ≤7.0 at 1MHz and volume resistivity >1×10¹² Ω·cm, providing robust electrical insulation in power-intensive applications. The material delivers comprehensive environmental protection against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for advanced circuit protection. Its Shore A hardness of 20±5 after curing balances mechanical protection with necessary flexibility for various industrial applications.
Applications include high-power LED systems, automotive power control units, industrial motor drives, and energy storage systems where maximum thermal performance is critical. The material's 60-minute operating time allows sufficient processing window for intricate encapsulation procedures. With the highest viscosity in the US Series, the US-5201-30 is particularly suited for applications requiring both superior thermal conductivity and structural stability in challenging environments.
The potting compound cures to form a durable protective barrier that enhances the reliability of electronic assemblies operating under extreme thermal conditions. Its combination of maximum thermal conductivity and reliable electrical insulation makes it ideal for high-power electronic applications where efficient heat management and electrical s
Quantity:
Product Description
US Series Thermal Potting Compounds are renowned for their distinctive characteristics, which include:
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
【Applications】
◆Electronic Components: Used in LED drivers, power supplies, and integrated circuits (ICs) to dissipate heat and shield against humidity/dust.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
Properties
| Item | Unit | US-5210-30 |
|---|---|---|
| Color | - | A: White B:Gray |
| Viscosity | cPs | 14000 ~ 15000 |
| Density | g/cm3 | A: 2.8±0.1 B: 2.8±0.1 |
| Before Mixing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Mass Ratio | - | 1:1 |
| Mixed Viscosity | cPs | 14000 ~ 15000 |
| Operating Time | min | 60 |
| Performance After Curing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Hardness | Shore A | 20±5 |
| Dielectric Strength | kV/mm | >10 |
| Volume Resistance | Ω·cm | >1*1012 |
| Dielectric Constant | 1MHz | ≤7.0 |
| Thermal Conductivity | W/m·k | 3.0 |
