SE500AB Two-Part Thermal Gel | 5.0W/mK Curable Thermal Compound | TOUSEN

SE500AB
The ​SE500AB Two-Part Thermal Gel​ is a high-performance ​thermal interface elastomer​ that delivers balanced thermal management with 5.0 W/m·K conductivity. This innovative ​two-component thermal compound​ cures into a durable elastomeric material, providing both efficient heat transfer and reliable mechanical protection for electronic components. The ​curable thermal compound​ features a optimized curing profile with tack-free time of 30 minutes and full cure in just 1 hour at room temperature, offering production flexibility for various manufacturing processes.

Technical Performance and Application Advantages

The ​SE500AB thermal interface elastomer​ demonstrates excellent performance in applications requiring both thermal management and structural protection. This ​two-part thermal gel​ maintains Shore 00 hardness of 55±10 after curing, ensuring proper component protection while providing effective heat dissipation. With dielectric strength exceeding 8 kV/mm and volume resistance >10¹⁴ Ω·cm, this ​curable thermal compound​ offers superior electrical insulation properties for sensitive electronic applications. The material's rapid curing characteristics at elevated temperatures (5 minutes @100°C) make this ​thermal interface elastomer​ ideal for high-volume production environments. Compliant with UL94 V-0 and international safety standards, the ​SE500AB​ provides reliable thermal solution for automotive electronics, power modules, and consumer electronics where balanced performance and manufacturing efficiency are key requirements.
Quantity:
Free Sample
Product Description

◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.  
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.  
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.  
◆ Excellent flame resistance, achieving a UL94 V-0 rating.  
◆ Curing time adjustable based on temperature.  
◆ Two-component structure for easy storage.  
◆ Can be precisely controlled for thickness and shape using automated equipment.  
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.  
 

【Applications】

◆ CPUs and GPUs  
◆ Power Supply Units (PSUs)  
◆ LED Modules  
◆ Engine Control Units (ECUs)  
◆ Gaming Consoles and Laptops  
 
Properties
 
Characteristic Parameter
PropertiesUnitSE500ABTest Method
Thermal ConductivityW/m·K5.0ASTM D5470
Flow Rate(@50cc,90psi)g/min15±5-
Color Before Curing-Part A: White
Part B: Pink
Visual
Densityg/cc3.1Helium Pycnometry
Mix Ratio-1:1-
Color After Curing-PinkVisual
Hardness After CuringShore 0055±10ASTM D2240
Tack-Free Time (@25℃)min30-
Full Cure Time (@25℃)h1-
Full Cure Time (@100℃)min5-
Minimum Interface Thicknessmm0.15-
Shelf Life (@25℃)months6-
Operating Temp.-50 ~ 150-
Dielectric Strength (@AC)kV/mm>8ASTM D149
Dielectric Constant (@1MHz)-7.5ASTM D150
Volume ResistivityΩ·cm>1014ASTM D257
Coefficient of Thermal Expansionppm/K175ASTM E831
Flame Rating-V-0UL94
RoHS-PASSIEC 62321
Halogen-PASSEN 14582
REACH-PASSEN 14372

【Storage & Transportation】

  Store in a well-ventilated, cool, and dry place, away from open flames.
  This product is non-toxic and should be stored and transported as a non-hazardous material.
 

【Packaging】

  ● 50cc ● 400cc
 

【Shelf Life】

   6 months