SE400AB Thermal Gap Filler | 4.0W/mK | TOUSEN

The ​SE400AB Thermal Gap Filler​ is a versatile ​two-part thermal interface material​ engineered to provide reliable thermal management with 4.0 W/m·K conductivity. This high-performance ​dielectric gel​ combines thermal conduction and electrical insulation properties, making it an ideal choice for applications requiring both heat dissipation and component protection. The ​thermal gap filler​ cures into a durable elastomer with Shore 00 hardness of 55±10, maintaining consistent interface thickness while providing excellent shock absorption capabilities.

Technical Specifications and Application Benefits

The ​SE400AB dielectric gel​ demonstrates outstanding performance as a ​thermal interface material​ in various electronic applications. With a rapid curing profile (30-minute tack-free time, 1-hour full cure at 25°C), this ​two-part thermal gap filler​ enables efficient manufacturing processes while ensuring reliable thermal performance. The material's excellent extrusion properties (30±5 g/min flow rate) allow for precise application control, achieving minimum interface thickness of 0.10mm. As a high-quality ​dielectric gel, it provides exceptional electrical insulation with dielectric strength >8 kV/mm and volume resistivity >10¹⁴ Ω·cm. The ​SE400AB thermal interface material​ maintains stable performance across a wide temperature range (-50°C to 150°C) and complies with UL94 V-0 flame rating, RoHS, Halogen-Free, and REACH standards, making it suitable for consumer electronics, LED modules, and automotive applications where balanced thermal performance and reliability are essential.