​CSF 30 Standard Grade Thermal Interface | TOUSEN

The ​CSF 30 Carbon Fiber Thermal Pad​ delivers ​balanced performance​ with 30.0W/mK thermal conductivity, positioning it as an ideal ​standard grade thermal interface​ solution for mainstream electronic applications. This ​carbon fiber thermal pad​ maintains the series' characteristic softness and compressibility while providing reliable thermal performance for applications requiring consistent heat dissipation. The material's optimized composition ensures efficient air displacement at component interfaces, delivering solid thermal conduction efficiency for various operating conditions.

Technical Performance and Application Value​

The ​CSF 30 balanced performance thermal pad​ demonstrates consistent reliability across multiple applications including 5G infrastructure, consumer electronics, and industrial controls. With a thermal impedance of 0.10°C·in²/W at 20psi for 1mm thickness, this ​standard grade thermal interface​ effectively bridges thermal gaps between components and cooling systems. The pad's natural adhesion properties facilitate straightforward installation, while its 20% elongation and 10±5% compression ratio accommodate various assembly requirements. Available in thicknesses from 0.3mm to 12.0mm, the ​CSF 30 carbon fiber thermal pad​ can be customized for specific applications in control boards, memory modules, and power systems. Maintaining operational stability from -50°C to 160°C with UL94 V-0 certification, this ​balanced performance​ material provides a cost-effective thermal solution for applications where reliable performance and value optimization are key considerations.