CSF 45 Carbon Fiber Thermal Pad | 45.0W/mK Soft Compressible TIM | TOUSEN

The ​CSF 45 Carbon Fiber Thermal Pad​ represents a breakthrough in ​ultra-high conductivity thermal interface materials, delivering exceptional 45.0W/mK thermal performance for demanding electronic applications. This advanced ​carbon fiber thermal pad​ combines superior thermal properties with excellent mechanical characteristics, featuring a soft, compressible structure that ensures optimal surface contact under low pressure conditions. The material's unique carbon fiber reinforcement provides enhanced thermal management capabilities while maintaining flexibility and ease of application.

Technical Performance and Application Advantages

The ​CSF 45 ultra-high conductivity thermal pad​ demonstrates outstanding performance in high-power applications including 5G base station RRUs, power chips, and advanced capacitor systems. With thermal impedance of 0.07°C·in²/W at 20psi for 1mm thickness, this ​carbon fiber thermal pad​ effectively eliminates air gaps between components and heat sinks, significantly improving heat transfer efficiency. The material's natural tackiness facilitates easy installation and reworkability, while its 10±5% optimal compression ratio ensures reliable performance in various assembly configurations. Available in thicknesses from 0.3mm to 12.0mm, this ​soft compressible TIM​ can be customized to meet specific design requirements for control boards, memory modules, and relay systems. The ​CSF 45​ maintains stable performance across -50°C to 160°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, providing a comprehensive thermal solution for applications where maximum thermal conductivity and mechanical compliance are critical requirements.