Phase Change Metal Thermal Pad GT-MPS Series | TOUSEN

The ​Phase Change Metal Thermal Pad GT-MPS Series​ represents a breakthrough in ​thermal interface materials​ (TIMs), engineered to deliver exceptional heat dissipation for high-power electronics. This innovative ​phase change thermal pad​ combines the handling convenience of solid pads with the ultimate performance of liquid metals. At room temperature, it maintains a stable solid form for easy installation. When operational temperatures reach its phase-change point (45-120°C), the material transitions to a liquid state, perfectly conforming to surface imperfections through capillary action. This unique phase-change mechanism enables the ​phase change thermal pad​ to eliminate microscopic air gaps between components and heat sinks, achieving ​ultra-low thermal resistance​ (as low as 0.03°C·cm²/W) and significantly enhancing heat transfer efficiency.

With thermal conductivity ratings of ≥60-70 W/m·K, this advanced ​thermal interface material​ ensures reliable thermal management in demanding applications including CPU servers, automotive IGBT modules, and industrial COB lighting. The metal-based composition eliminates silicone oil and volatile substances, preventing pump-out and degradation issues common to traditional thermal greases. This ​phase change thermal pad​ offers stable performance across extreme temperature ranges (-50°C to 150°C) while maintaining consistent ​low thermal resistance​ throughout its service life. The ​GT-MPS series phase change thermal pad​ provides a maintenance-free solution that outperforms conventional thermal materials, making it the ideal choice for engineers seeking to optimize thermal performance in compact, high-power designs. By ensuring sustained ​low thermal resistance, this ​thermal interface material​ effectively prevents thermal throttling and extends component lifespan in critical electronic systems.