High-Performance Graphene Thermal Pad GT-VGS Series | TOUSEN
GT -VGS -Series
Optimized Product Detailed Description:
The Graphene Thermal Pad GT-VGS Series from TOUSEN represents a significant advancement in thermal interface materials (TIMs). Engineered with a proprietary graphene-silicone composite, this pad delivers exceptional heat dissipation for demanding electronic applications. Its unique formulation ensures high thermal conductivity, effectively transferring heat away from critical components to maintain optimal operating temperatures and enhance device longevity and reliability.
Key Performance Advantages:
Superior Thermal Management: The graphene thermal pad boasts a high thermal conductivity rating ranging from ≥20 W/m·K to ≥30 W/m·K (depending on thickness), ensuring efficient heat transfer from heat sources like CPUs, GPUs, and power management ICs to heat sinks. This effectively reduces hotspots and mitigates thermal throttling.
Low Thermal Resistance & Excellent Conformability: Designed for minimal contact thermal resistance, the pad readily conforms to uneven surfaces, filling microscopic air gaps that impede heat flow. Its high compressibility ensures optimal surface contact under low mounting pressures, maximizing thermal transfer efficiency across various assembly configurations.
Robust Reliability & Versatility: The Graphene Thermal Pad GT-VGS Series operates reliably across a wide temperature range of -50°C to 150°C. It provides additional benefits such as shock absorption and impact protection. Compliant with UL 94 V-0 flame retardant standards and ROHS 2.0, it is suitable for a broad spectrum of industries, including mobile devices, telecommunications infrastructure, automotive electronics, servers, and PC equipment.
The Graphene Thermal Pad GT-VGS Series from TOUSEN represents a significant advancement in thermal interface materials (TIMs). Engineered with a proprietary graphene-silicone composite, this pad delivers exceptional heat dissipation for demanding electronic applications. Its unique formulation ensures high thermal conductivity, effectively transferring heat away from critical components to maintain optimal operating temperatures and enhance device longevity and reliability.
Key Performance Advantages:
Superior Thermal Management: The graphene thermal pad boasts a high thermal conductivity rating ranging from ≥20 W/m·K to ≥30 W/m·K (depending on thickness), ensuring efficient heat transfer from heat sources like CPUs, GPUs, and power management ICs to heat sinks. This effectively reduces hotspots and mitigates thermal throttling.
Low Thermal Resistance & Excellent Conformability: Designed for minimal contact thermal resistance, the pad readily conforms to uneven surfaces, filling microscopic air gaps that impede heat flow. Its high compressibility ensures optimal surface contact under low mounting pressures, maximizing thermal transfer efficiency across various assembly configurations.
Robust Reliability & Versatility: The Graphene Thermal Pad GT-VGS Series operates reliably across a wide temperature range of -50°C to 150°C. It provides additional benefits such as shock absorption and impact protection. Compliant with UL 94 V-0 flame retardant standards and ROHS 2.0, it is suitable for a broad spectrum of industries, including mobile devices, telecommunications infrastructure, automotive electronics, servers, and PC equipment.
Quantity:
Product Description
The TOUSEN GT-VGS Series Graphene Thermal Pad is a premium class of Thermal Interface Materials renowned for its distinctive characteristics, which include:
◆ High Thermal Conductivity
◆ Low Contact Thermal Resistance
◆ High Compressibility
◆ Resistant to High and Low Temperatures
◆ Z-Axis Heat Transfer
◆ Provides shock absorption and impact protection
【Applications】
◆ Mobile Devices
◆ TV and PC Equipment
◆ Wireless Base Stations, Wired Communication Equipment, Servers
◆ Heat dissipation for high-power LSIs in automotive applications and other devices requiring High Thermal Conductivity
Properties
| Product Series | GT-VGS-Series | Reference Standards | ||||
|---|---|---|---|---|---|---|
| Product Features | Silicone Composite Material | - | ||||
| Composition | Graphene, Silicone | - | ||||
| State | Gray-black flakes | Visual Inspection | ||||
| Thickness(mm) | 0.3 | 0.5 | 1 | 1.5 | 2 | ASTM D374 |
| Product Specifications(mm) | 40*60 | 40*134 | 40*134 | 40*134 | 40*134 | - |
| Thermal Conductivity (W/m·K) | ≥20W | ≥20W | ≥25W | ≥25W | ≥30W | ASTM D5470 |
| Compressibility (%) | ≥15 | ≥20 | ≥30 | ≥30 | ≥30 | 30PSI |
| Volume Resistivity(Ω·cm) | 8~30 | ASTM D257 | ||||
| Operating TemperatureRange(℃) | -50~150℃ | - | ||||
| Corrosiveness | None | - | ||||
| Environmental Performance | ROHS 2.0 | - | ||||
| Flame Retardant Rating | V-0 | UL-94 | ||||
Application Testing
Test ltem: Notebook Application Verification
Test Equipment: Terrans Force (lntel 13th Gen)
Test Software: Benchmarking
Test Samples: Original Liquid Metal Thermal Grease8079; GT-MPS Phase Change Metal Pad; GT-6Series Metal Paste; GT-VGS 0.3mmT Graphene Pad
Test Description: 22°C ambient temperature; powered on; performance mode; CPU power 160W
Test Results: The original (thermal grease) showed throttling during the test; other materials were able to maintain high-frequency performance.
