TP1/C1201 Copper Foil Electronic Grade Copper Material | TOUSEN
TP1/C1201/C12100 copper
The TP1/C1201 Copper Foil is a high-purity electronic grade copper material designed for applications requiring exceptional thermal and electrical performance. This copper foil delivers 350W/m·K thermal conductivity and 52MS/m electrical conductivity, providing efficient heat dissipation and reliable signal transmission in electronic systems. With copper content exceeding 99.9% and density of 8.94g/cm³, the material ensures consistent performance in demanding thermal management applications.
This high conductivity copper foil exhibits excellent mechanical properties with tensile strength ranging from 245 to 345MPa and elongation at break ≥24.3%. The material's hardness varies from 40 to 120HV, offering both durability and workability for manufacturing processes. With low resistivity of 1.91×10⁻⁸Ω·m and specific heat capacity of 385.2J/kg·℃, the copper foil maintains stable performance across various operating conditions, featuring a melting point of 1083°C.
Applications include electronic components where the copper foil serves as conductive material in wires and cables, ensuring stable electrical signal transmission. In heat exchange systems, it enhances thermal performance in evaporators and storage devices, improving overall heat transfer efficiency. The manufacturing industry utilizes this material for brazed components, taking advantage of its corrosion resistance and excellent processability for production applications.
The copper foil's combination of high thermal conductivity and electrical performance makes it suitable for applications requiring both efficient heat dissipation and reliable electrical conduction. Its balanced mechanical properties allow for easy fabrication while maintaining structural integrity in final applications. The material is particularly valuable in precision electronic devices where thermal management and signal integrity are critical considerations.
This high conductivity copper foil exhibits excellent mechanical properties with tensile strength ranging from 245 to 345MPa and elongation at break ≥24.3%. The material's hardness varies from 40 to 120HV, offering both durability and workability for manufacturing processes. With low resistivity of 1.91×10⁻⁸Ω·m and specific heat capacity of 385.2J/kg·℃, the copper foil maintains stable performance across various operating conditions, featuring a melting point of 1083°C.
Applications include electronic components where the copper foil serves as conductive material in wires and cables, ensuring stable electrical signal transmission. In heat exchange systems, it enhances thermal performance in evaporators and storage devices, improving overall heat transfer efficiency. The manufacturing industry utilizes this material for brazed components, taking advantage of its corrosion resistance and excellent processability for production applications.
The copper foil's combination of high thermal conductivity and electrical performance makes it suitable for applications requiring both efficient heat dissipation and reliable electrical conduction. Its balanced mechanical properties allow for easy fabrication while maintaining structural integrity in final applications. The material is particularly valuable in precision electronic devices where thermal management and signal integrity are critical considerations.
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Product Description
【Applications】
◆Electronic components: used as conductive materials to manufacture wires and cables, ensuring the stability of electrical signal transmission.
◆Heat exchanger: suitable for evaporators, storage devices, etc., to enhance their thermal conductivity and improve heat exchange efficiency.
◆Manufacturing industry: In the manufacturing process, such as making brazed components, utilizing their corrosion resistance and processability.
◆Heat exchanger: suitable for evaporators, storage devices, etc., to enhance their thermal conductivity and improve heat exchange efficiency.
◆Manufacturing industry: In the manufacturing process, such as making brazed components, utilizing their corrosion resistance and processability.
Properties
| Item | Unit | SPEC.VALUES |
|---|---|---|
| Copper content | % | ≥99.9 |
| density | g/cm3 | 8.94 |
| Specific heat capacity | J/kg·℃ | 385.2 |
| resistivity | Ω·m | 1.91*10-8 |
| hardness | HV | 40 ~ 120 |
| conductivity | MS/m | 52 |
| melting point | ℃ | 1083 |
| thermal conductivity | W/(m·K) | 350 |
| tensile strength | MPa | 245 ~ 345 |
| Elongation at break | % | ≥24.3 |