T1/C1020 Copper Foil | Electronic Component Material | TOUSEN

The T1/C1020 Copper Foil is an ultra-high purity copper material designed for applications requiring exceptional thermal and electrical performance. This copper foil delivers thermal conductivity of 401W/m·K and electrical conductivity of 58MS/m, providing efficient heat dissipation and reliable signal transmission in electronic systems. With copper content ≥99.95% and density of 8.92g/cm³, the material ensures consistent performance in demanding thermal management applications.

This high thermal conductivity copper foil exhibits excellent mechanical properties with tensile strength of 295MPa and elongation at break ≥5%. The material's hardness of 80HV offers durability while maintaining workability for manufacturing processes. With low resistivity of 1.76×10⁻⁸Ω·m and specific heat capacity of 385J/kg·℃, the copper foil maintains stable performance across various operating conditions, featuring a melting point of 1083°C.

Applications include electronic components where the copper foil serves as conductive material in wires and cables, ensuring stable electrical signal transmission with minimal energy loss. In heat exchange systems, it enhances thermal performance in evaporators and storage devices, improving overall heat transfer efficiency. The manufacturing industry utilizes this material for brazed components, leveraging its corrosion resistance and processability for production applications.

The copper foil's combination of ultra-high thermal conductivity and electrical performance makes it suitable for applications requiring both efficient heat dissipation and reliable electrical conduction. Its balanced mechanical properties allow for easy fabrication while maintaining structural integrity in final applications. The material is particularly valuable in high-performance electronic devices where thermal management and signal integrity are critical considerations.