TP2/C1220 Copper Foil | Electronic Component Material | TOUSEN
TP2/ Cu-OFE/C1220/C12200 copper
The TP2/C1220 Copper Foil is a high-purity copper material with excellent electrical and thermal conductivity properties, designed for electronic and thermal management applications. This copper foil features thermal conductivity of 340W/m·K and electrical conductivity ranging from 48 to 82MS/m, providing efficient heat transfer and electrical signal transmission. With copper content exceeding 99.9% and density of 8.94g/cm³, the material ensures reliable performance in demanding environments.
This high conductivity copper foil demonstrates robust mechanical properties, including tensile strength of 215-310MPa and elongation at break of 24.3%. The material's hardness ranges from 55 to 100HV, offering durability while maintaining processability for various manufacturing requirements. With a melting point of 1083°C and specific heat capacity of 386J/kg·℃, the copper foil maintains stability across wide temperature ranges.
Applications include electronic components where the copper foil serves as conductive material for wires and cables, ensuring stable electrical signal transmission. In heat exchange systems, the material enhances thermal conductivity in evaporators and storage devices, improving heat exchange efficiency. The manufacturing industry utilizes this copper foil for brazed components, leveraging its corrosion resistance and workability in production processes.
The copper foil's low resistivity of 2.03×10⁻⁸Ω·m makes it suitable for high-frequency applications requiring minimal signal loss. Its combination of thermal and electrical performance makes it ideal for applications where both heat dissipation and electrical conductivity are critical. The material complies with international standards and offers consistent quality for industrial applications.
This high conductivity copper foil demonstrates robust mechanical properties, including tensile strength of 215-310MPa and elongation at break of 24.3%. The material's hardness ranges from 55 to 100HV, offering durability while maintaining processability for various manufacturing requirements. With a melting point of 1083°C and specific heat capacity of 386J/kg·℃, the copper foil maintains stability across wide temperature ranges.
Applications include electronic components where the copper foil serves as conductive material for wires and cables, ensuring stable electrical signal transmission. In heat exchange systems, the material enhances thermal conductivity in evaporators and storage devices, improving heat exchange efficiency. The manufacturing industry utilizes this copper foil for brazed components, leveraging its corrosion resistance and workability in production processes.
The copper foil's low resistivity of 2.03×10⁻⁸Ω·m makes it suitable for high-frequency applications requiring minimal signal loss. Its combination of thermal and electrical performance makes it ideal for applications where both heat dissipation and electrical conductivity are critical. The material complies with international standards and offers consistent quality for industrial applications.
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Product Description
【Applications】
◆Electronic components: used as conductive materials to manufacture wires and cables, ensuring the stability of electrical signal transmission.
◆Heat exchanger: suitable for evaporators, storage devices, etc., to enhance their thermal conductivity and improve heat exchange efficiency.
◆Manufacturing industry: In the manufacturing process, such as making brazed components, utilizing their corrosion resistance and processability.
◆Heat exchanger: suitable for evaporators, storage devices, etc., to enhance their thermal conductivity and improve heat exchange efficiency.
◆Manufacturing industry: In the manufacturing process, such as making brazed components, utilizing their corrosion resistance and processability.
Properties
| Item | Unit | SPEC.VALUES |
|---|---|---|
| Copper content | % | ≥99.9 |
| density | g/cm3 | 8.94 |
| Specific heat capacity | J/kg·℃ | 386 |
| resistivity | Ω·m | 2.03*10-8 |
| hardness | HV | 55 ~ 100 |
| conductivity | MS/m | 48 ~ 82 |
| melting point | ℃ | 1083 |
| thermal conductivity | W/(m·K) | 340 |
| tensile strength | MPa | 215 ~ 310 |
| Elongation at break | % | 24.3 |