TSAD60-3 Thermal Paste

TSAD60-3
TOUSEN thermally conductive compounds are grease like materials that are highly loadedwith thermally conductive fillers in a silicone matrix. This combination promotes high thermalconductivity, low bleed and high-temperature stability. The compounds are designed tomaintain a positive heat sink seal to improve heat transfer from an electrical device or PCBsystem assembly to a heat sink or chassis, thereby increasing the overall efficiency of thedevice. PCB system assemblies are continually designed to deliver higher performance.
Quantity:
Free Sample
Product Description
 
Thermally Conductive Paste are renowned for their distinctive characteristics, which include: 
Gray, thixotropic, non-curing thermally conductive compound.  
One part material - no cure required.  
Solvent free formulation - provides material stability.  
Easy application -Screen printable.  
Thixotropic - low slump.  
High thermal conductivity.  
Achieves thin Bond Line Thickness (BLT).  
Low thermal resistance.  

 

【Applications】

◆ CPUs and GPUs  
◆ Power Supply Units (PSUs)  
◆ LED Modules  
◆ Engine Control Units (ECUs)  

◆ Gaming Consoles and Laptops  
 
 
Properties
 
Characteristic Parameter TSAD60-3
ProductTSAD60-3 Thermally Conductive Paste
colourGray
Thermal Conductivity(W/m·℃)2.8
Thermal Resistance Coeffcient(℃·cm2/W), 60Psi0.09
Volume Resistivity(Ω)1.8*1012
Viscosity Value at 22℃(Pa.s)5.7000.000
Specifc Gravity(g/cm3)2.6
Oil Separation Rate(%), 200℃@96hours<0.01
Liquid Evaporation Loss(%), 120℃@96hours0.18
Storage Temperature(℃)15-25℃
Shelf Life (25℃) in Days720
 

【Storage & Transportation】

  Store in a well-ventilated, cool, and dry place, away from open flames.
  This product is non-toxic and should be stored and transported as a non-hazardous material.
 

【Packaging】

  Customized packaging according to customer requirements.
 

【Shelf Life】

  12 months