INSOK800 Indium Alloy Thermal Pad 80W/m·K | TOUSEN
INSOK800
The INSOK800 Indium Alloy Thermal Pad represents the pinnacle of thermal interface materials, engineered specifically for extreme heat dissipation challenges. This advanced thermal solution utilizes a premium indium alloy composition to achieve an exceptional thermal conductivity rating of ≥80 W/m·K, far surpassing conventional thermal materials. The unique properties of this indium alloy thermal pad make it ideal for applications where maximum thermal performance is critical. Its low hardness, excellent ductility, and high plasticity allow it to conform perfectly to irregular surfaces, creating an optimal thermal path between heat sources and heat sinks. The INSOK800 thermal pad can be precision-engineered into custom patterns including stripes or grids, significantly increasing the contact area with heat-generating components to enhance thermal transfer efficiency.
Performance Advantages and Applications
The primary advantage of the INSOK800 Indium Alloy Thermal Pad lies in its ability to achieve ultra-low thermal resistance while maintaining structural integrity under demanding conditions. With a thermal resistance as low as 0.15°C·cm²/W at 40psi, this indium alloy thermal pad ensures efficient heat transfer from high-power components including immersion-cooled server CPUs, laser systems, and IGBT power modules. The material's high thermal conductivity of ≥80 W/m·K provides superior performance compared to standard thermal interface materials, making the INSOK800 particularly valuable in applications requiring rapid heat dissipation. The indium alloy composition offers excellent corrosion resistance and maintains stable physical properties without silicone oil or volatile substances, ensuring long-term reliability in critical thermal management systems. Whether used in advanced computing infrastructure, power electronics, or specialized industrial equipment, the INSOK800 Indium Alloy Thermal Pad delivers unmatched thermal performance that exceeds
Performance Advantages and Applications
The primary advantage of the INSOK800 Indium Alloy Thermal Pad lies in its ability to achieve ultra-low thermal resistance while maintaining structural integrity under demanding conditions. With a thermal resistance as low as 0.15°C·cm²/W at 40psi, this indium alloy thermal pad ensures efficient heat transfer from high-power components including immersion-cooled server CPUs, laser systems, and IGBT power modules. The material's high thermal conductivity of ≥80 W/m·K provides superior performance compared to standard thermal interface materials, making the INSOK800 particularly valuable in applications requiring rapid heat dissipation. The indium alloy composition offers excellent corrosion resistance and maintains stable physical properties without silicone oil or volatile substances, ensuring long-term reliability in critical thermal management systems. Whether used in advanced computing infrastructure, power electronics, or specialized industrial equipment, the INSOK800 Indium Alloy Thermal Pad delivers unmatched thermal performance that exceeds
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Product Description
INSOK800 Indium Alloy Heat-conducting Fin are renowned for their distinctive characteristics, which include:
◆Its thermal conductivity far surpasses that of traditional sid thermal materials.
◆Low hardness, good ductility, high plasticity, and corrosion resistance.
◆It has stable physical and chemical properties, is non-toxic and harmless, and contains no volatile substances such as silicone oil.
◆High stability and reliability, superior to existing thermal interface materials.
◆Its thermal conductivity far surpasses that of traditional sid thermal materials.
◆Low hardness, good ductility, high plasticity, and corrosion resistance.
◆It has stable physical and chemical properties, is non-toxic and harmless, and contains no volatile substances such as silicone oil.
◆High stability and reliability, superior to existing thermal interface materials.
【Applications】
◆CPU in Immersion Water-Cooled Server
◆Laser
◆Power Module IGBT
◆Low-Temperature Solder
◆Laser
◆Power Module IGBT
◆Low-Temperature Solder
Properties
| Model/Series | INSOK800 | Reference Standards | |
|---|---|---|---|
| Color | Bright silver flake | Visual inspection | |
| Thermal Conductivity (W/M·K) | ≥80W | Laser Flash Method | |
| Thermal Resistance | Normal | 0.33 | 40psi, 0.15mm ASTMD5470 |
| Embossing | 0.26 | ||
| Thickness (mm) | Normal | 0.1 - 0.2 | Thickness can be customized |
| Embossing | |||
| Specific Heat (J/g·K) | 0.238M | ASTM E1269-2011 | |
| Elting Point (℃) | 150±27 | 1GB/T 1425-1996 | |
| Density (g/cm3) | 7.23 | ASTMD792 | |
| Volume Resistivity (Ω·cm) | 5*10-6 | ASTMD792 | |
| Volatility Rate (%) | <0.001 | - | |
| Environmental Performance | ROSH 2.0 | - | |
| Rrosiveness | None | - | |
【Storage Condition】
Store in a shaded environment at a normal temperature below 30℃, with a relative humidity of 40%-60%.Store sealed or in a vacuum, and it is recommended to use within 3 months.
Pressure vs Thermal Resistance Curve
