​SE30 Thermal Gel 3.0W/mK | Single-Part Thermal Putty | TOUSEN

The ​SE30 Thermal Gel​ is an economical ​single-part thermal putty​ delivering reliable 3.0 W/m·K thermal conductivity for standard electronic cooling applications. This practical ​thermal gel​ utilizes a silicone resin-based formulation that provides effective gap-filling performance between heat-generating components and heat sinks. As a versatile ​thermal putty, the material offers balanced thermal impedance (0.08°C·in²/W) with minimal oil separation, ensuring stable performance in various operating conditions. The ​SE30 thermal gel​ combines user-friendly application with consistent thermal management capabilities, making it an ideal cost-effective solution for general electronic cooling requirements.

​Technical Performance and Application Advantages

The ​SE30 thermal putty​ demonstrates reliable performance in applications including CPUs, GPUs, and power supply units. This ​single-part thermal putty​ features good extrusion properties (25±5 g/min) and can be efficiently applied using automated dispensing equipment. The material's compliant nature ensures minimal stress on components while maintaining adequate surface contact. With dielectric strength exceeding 5000 V/mm and volume resistance >10¹² Ω·cm, this ​thermal gel​ provides both thermal management and electrical insulation benefits. The ​SE30 thermal putty​ maintains stable performance across -40°C to 150°C temperature range and complies with UL94 V-0, RoHS, and REACH standards, making it suitable for consumer electronics, LED modules, and general industrial applications where reliable thermal performance and safety are essential considerations.