TSAD90 PLUS Thermal Grease | TOUSEN

The ​TSAD90 PLUS Thermal Grease​ represents an advanced ​thermal interface material​ engineered for superior heat dissipation in high-performance electronic applications. This premium ​thermal compound​ delivers excellent 6.5W/m·K thermal conductivity while maintaining low thermal resistance of 0.03°C·cm²/W at 60psi. The ​thermal grease​ features a optimized silicone-based formulation with highly loaded conductive fillers, ensuring efficient heat transfer from electronic components to heat sinks. This high-performance ​thermal interface material​ provides reliable thermal management for demanding applications where consistent performance and long-term stability are essential requirements.

Technical Specifications and Application Performance

The ​TSAD90 PLUS thermal compound​ demonstrates exceptional stability with minimal oil separation (<0.01% at 200°C) and low evaporation loss (0.18% at 120°C). This reliable ​thermal grease​ maintains optimal viscosity (120Pa·s at 22°C) for easy screen printing application, while its thixotropic properties prevent slump during processing. With volume resistivity of 1.8×10¹² Ω, this ​thermal interface material​ provides excellent electrical insulation alongside its thermal management capabilities. The ​TSAD90 PLUS thermal compound​ is ideal for CPUs, GPUs, power supply units, and automotive electronics applications where high temperature stability and consistent thermal performance are critical. Its 720-day shelf life at 25°C ensures long-term material reliability for various industrial and consumer electronic applications.