Solution for products in telecommunications data communication

The optical module is an important component of fiber optic communication, mainly composed of optoelectronic devices (optical transmitter, optical receiver), functional circuits, and optical interfaces, which realize the photoelectric conversion and electro-optical conversion in the process of optical signal transmission. The higher the transmission rate of the optical module, the greater the data transmission. In order for the optical chip to work stably within a suitable temperature range, an effective heat dissipation channel is crucial in the design of the optical transmission module, and strict requirements are placed on the oil yield and volatile matter of the thermal interface material.

The thermal interface materials that can be applied to the surface of the optical transmission module on DSP, MCU, power chip, as well as the upper and lower surfaces of the optical transmitter and receiver:

Hardness, oil yield, volatile matter, carrier, and resilience can be flexibly designed according to customer needs; Good flexibility and rebound performance cover uneven surfaces and reduce structural stress, protecting structural components.
Low compressive stress, no stress damage to components; Good surface wettability; Low oil yield, high reliability, wide temperature resistance range; Can achieve automatic dispensing process to improve operational efficiency; After extrusion, the shape remains unchanged without flowing or collapsing, making it easy to operate.
The two-component gel is in gel state before curing and has strong caulking ability. After curing, it is close to the thermal conductive gasket, with low oil yield and good anti sag performance.
  

The security monitoring system mainly includes front-end equipment, transmission equipment, processing/control equipment, and recording/display equipment. The increasing demand for security has led to higher requirements for image transmission speed, image clarity, and data storage time. The improvement of security monitoring system configuration has brought greater power consumption and heat generation to its circuit system, so an effective heat dissipation solution is needed to maintain the normal operating temperature of the core chip and avoid inconvenience caused by monitoring data problems.

Thermal interface materials applicable to security monitoring systems:

Thermal pads can be used to fill the gaps between heat generating electronic components such as CPUs, memory, graphics cards, and casings on motherboards, improving heat dissipation efficiency. The thermal pad is soft and has high resilience, low assembly pressure, and can be designed with surface adhesion, making it easy to peel off and rework.
Silicon free thermal pads are suitable for devices sensitive to organic silicon and can be used in image processing modules without contaminating optical lenses or affecting the clarity of monitoring videos. The silicon free thermal conductive gasket is a composite sheet composed of resin without organic silicon and thermal conductive filler, which solves the problem of silicone volatilization from the raw material.

Routers and switches are the basic components of data communication networks. In the current stage of intelligent upgrading of electronic and industrial equipment, routers and switches can provide network and forwarding data. Routers and switches are mainly composed of integrated circuits such as chips and memory. While improving network transmission speed, effective heat dissipation of chips has also become an urgent problem to be solved.

Applicable thermal interface materials:

Thermal pads can be used to fill the gaps between heat generating electronic components such as CPUs, memory, graphics cards, and casings on motherboards, improving heat dissipation efficiency. The thermal pad is soft and has high resilience, low assembly pressure, and can be designed with surface adhesion, making it easy to peel off and rework.
In the main chip heat dissipation area, there is a shielding cover device, and thermal conductive silicone grease can fully fill the gap between the chip and the shielding cover, assisting the chip in effective heat transfer and heat dissipation. Thermal conductive silicone grease can be applied to the surface of the target device, effectively reducing interfacial thermal resistance.
It can be used to fill gaps in shielding covers and also for heat dissipation on the back of chips. The state of the paste before curing determines that it has better filling ability than the thermal conductive sheet. After curing, it is close to the thermal conductive gasket, with low oil yield, good anti sagging performance, no gas release, good toughness, and good anti vibration performance.

Enterprise level servers are often used with hundreds or more networked computers, with strict requirements for data processing speed and data security management, as well as high requirements for hardware configuration and system reliability. SMP typically uses multiple to dozens of CPUs, with independent dual PCI channels and memory expansion board designs, high memory bandwidth, large capacity hot swappable hard drives, and hot swappable power supplies.

Thermal interface materials and insulation materials applicable to enterprise level servers:

Can be used for cooling network card chips, GPUs, and CPUs. Using organic silicone as the main raw material, it has high fluidity, good wettability on the surface of the target device, good thermal conductivity, low thermal resistance, and is suitable for occasions with high heat dissipation requirements.

Thermal pads can be used for disk arrays (RAID) and SSD memory in servers. The thermal pad is soft and resilient, with good compressibility; Smooth and flat surface, resistant to friction and puncture; The surface has inherent stickiness and does not require additional adhesive.

Thermal phase change film can be used for heat dissipation of server CPUs. When the surface temperature of the CPU reaches the phase change temperature, the viscosity decreases under low pressure and transforms from solid to liquid, resulting in low thermal resistance and forming a good thermal interface.

The thermal conductive gel can be used for the disk array (RAID) and SSD memory of the server. The thermal conductive gel paste is soft, with ultra-low compression stress and no stress damage to components. Good surface wettability, suitable for spot coating of irregular target components.

The infrastructure construction of 5G mobile communication is the fundamental link of 5G network coverage. The infrastructure used for mobile communication includes base stations, power systems, lightning protection and grounding systems, as well as source equipment and power systems between remote devices. At present, the construction of 5G communication base stations has entered a critical period of large-scale development. Compared to 4G, 5G has the requirements of ultra-high speed, ultra-low latency, and ultra wide connectivity, which requires higher performance processors and dedicated integrated circuits to improve data transmission performance. At the same time, AAU and BBU work with high power consumption and increased heat dissipation. If the internal temperature of the base station is too high, it will affect the normal operation of internal components and cause network instability.

It can be used for heat dissipation of processors and FPGA chips, and its good thermal conductivity and electrical insulation help to effectively dissipate heat and ensure safe operation of heat generating electronic components. The construction of communication infrastructure is carried out outdoors with varying climate conditions, and thermal pads meet the temperature requirements of -60~200 ℃, which can adapt to extreme weather conditions outdoors.
It can be used for heat dissipation between power tubes and heat sinks, and can be fastened with screws to ensure that the thermal insulation film fully contacts the heat source interface and heat dissipation interface, improving heat dissipation efficiency. The thermal insulation film has high tensile strength, good insulation performance, and good flame retardancy, meeting UL's environmental requirements.
It can be used for heat transfer between irregular integrated circuits and heat sinks. The thermal conductive gel gel is soft and has low compression stress, which can be used for spot coating of irregular target components. It has high thermal conductivity and low thermal resistance, and is suitable for scenarios with large heat dissipation requirements.
Release time: 2025-10-16