US-5201-10 Thermal Potting Compound | TOUSEN
US-5201-10
The US-5201-10 Thermal Potting Compound is a two-component liquid encapsulation material designed for electronic applications requiring reliable thermal management and environmental protection. With a thermal conductivity of 1.0W/m·K and viscosity range of 2,500-3,000cPs, this potting compound provides effective heat dissipation while maintaining excellent electrical insulation properties. The material features a precise 1:1 mass mixing ratio and cures to form a durable protective barrier with Shore A hardness of 20±5.
This thermal potting material delivers strong dielectric performance with a dielectric constant ≤4.5 at 1MHz and volume resistivity >1×10¹² Ω·cm, ensuring electrical safety in sensitive electronic assemblies. The compound offers comprehensive environmental sealing against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for enhanced circuit protection. Its wide temperature resistance maintains stability across various operating conditions.
Applications include LED drivers, power supplies, automotive ECUs, and industrial control systems where balanced thermal performance and environmental protection are essential. The material's 60-minute operating time provides adequate processing flexibility for complex potting applications. With density of 2.2±0.1g/cm³ for both components, the US-5201-10 ensures consistent mixing and reliable curing performance.
The potting compound is particularly suitable for applications requiring moderate thermal conductivity combined with robust environmental sealing. Its electrical insulation properties prevent short circuits while effectively managing heat generation in electronic components. The material cures to form a permanent protective layer that enhances the longevity and reliability of electronic assemblies in demanding operating environments.
This thermal potting material delivers strong dielectric performance with a dielectric constant ≤4.5 at 1MHz and volume resistivity >1×10¹² Ω·cm, ensuring electrical safety in sensitive electronic assemblies. The compound offers comprehensive environmental sealing against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for enhanced circuit protection. Its wide temperature resistance maintains stability across various operating conditions.
Applications include LED drivers, power supplies, automotive ECUs, and industrial control systems where balanced thermal performance and environmental protection are essential. The material's 60-minute operating time provides adequate processing flexibility for complex potting applications. With density of 2.2±0.1g/cm³ for both components, the US-5201-10 ensures consistent mixing and reliable curing performance.
The potting compound is particularly suitable for applications requiring moderate thermal conductivity combined with robust environmental sealing. Its electrical insulation properties prevent short circuits while effectively managing heat generation in electronic components. The material cures to form a permanent protective layer that enhances the longevity and reliability of electronic assemblies in demanding operating environments.
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Product Description
US Series Thermal Potting Compounds are renowned for their distinctive characteristics, which include:
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
【Applications】
◆Electronic Components: Used in LED drivers, power supplies, and integrated circuits (ICs) to dissipate heat and shield against humidity/dust.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
Properties
| Item | Unit | US-5210-10 |
|---|---|---|
| Color | - | A: White B:Gray |
| Viscosity | cPs | 2500 ~ 3000 |
| Density | g/cm3 | A: 2.2±0.1 B: 2.2±0.1 |
| Before Mixing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Mass Ratio | - | 1:1 |
| Mixed Viscosity | cPs | 2500 ~ 3000 |
| Operating Time | min | 60 |
| Performance After Curing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Hardness | Shore A | 20±5 |
| Dielectric Strength | kV/mm | >10 |
| Volume Resistance | Ω·cm | >1*1012 |
| Dielectric Constant | 1MHz | ≤4.5 |
| Thermal Conductivity | W/m·k | 1.0 |
