Photovoltaic inverter solution

chace | 2025-10-29

Micro inverter

Specifically referring to inverters with component level MPPT for photovoltaic power generation systems with a total power below 1kW, independently controlling each component, optimizing the output power of each component, and maximizing the overall output power of the photovoltaic power generation system. Micro inverters are mainly used in small and medium-sized industrial and commercial rooftop power stations, as well as household rooftop photovoltaic power generation systems. Micro inverters are compact in size, lightweight, with tightly arranged internal electronic components and concentrated heat dissipation. In order to meet the requirements of micro lightweight inverters, thermal management layout is also a key consideration for product design engineers.

Thermal interface conductive materials applicable to micro inverters:

Can be applied to power module IGBT and current sensors to improve the heat dissipation efficiency of heating electronic components and maintain stable operation of the power module. Good fluidity and excellent wetting properties. Good thixotropy, can achieve extremely low thermal resistance, and excellent thermal conductivity
 

String inverter

It is a photovoltaic cascade (1-5kW) connected in parallel to the AC terminal through an inverter. Adopting a modular design that is not affected by each other, reducing the impact of mismatched photovoltaic modules and inverters, and increasing power generation efficiency. String inverters are mainly used for small and medium-sized rooftop photovoltaic power generation systems and small ground power stations. String inverters have small size, light weight, concentrated internal electronic components, small electrical clearances between power devices, difficult heat dissipation, and poor electrical safety. Boon Industrial's thermal interface thermal conductive materials can meet both excellent thermal conductivity and good electrical insulation performance.

 

Thermal interface conductive materials applicable to string inverters:

Can be applied to power module IGBT and current sensors to improve the heat dissipation efficiency of heating electronic components and maintain stable operation of the power module. Good fluidity and excellent wetting properties. Good thixotropy, can achieve extremely low thermal resistance, and excellent thermal conductivity
Thermal pads can be used for thermal filling of semiconductor and magnetic devices in string inverters. Thermal pads have good thermal conductivity and electrical insulation, and are easy to peel and operate.
Thermal insulation film can be used for heat dissipation between IGBT, diode and heat sink in inverter power modules. It can be fastened with screws to fully contact the heat source interface and heat dissipation interface, improving heat dissipation efficiency

Thermal conductive sealing adhesive can be used for the injection sealing of inverter inductor blocks (boost inductors/inverter inductors), helping to evenly dissipate heat from heating electronic components while avoiding direct exposure of components and circuits, improving the waterproof, dustproof, and moisture-proof performance of the devices.

Centralized inverter

Commonly used in large-scale power generation systems such as factories and power stations, with a total system power of over megawatts, usually paired with IGBT power modules and DSP conversion controllers to improve the quality of output electrical energy. High integration, high energy density, and significant heat generation. If the temperature is too high, it will affect the working efficiency and even reduce the lifespan of electronic components, thereby affecting the photoelectric conversion efficiency of photovoltaic systems. Therefore, it is very important to choose a suitable thermal interface material to ensure the reliability and durability of the equipment.

 

Thermal interface conductive materials applicable to centralized inverters:

Can be applied to power module IGBT and current sensors to improve the heat dissipation efficiency of heating electronic components and maintain stable operation of the power module. Good fluidity, excellent wetting performance, and good thixotropy;
The thickness can reach below 10 μm, and the thermal resistance is extremely low.
Thermal pads can be used for thermal filling between the back of PCB board and the shell. The thermal pad is soft and resilient, and has good thermal conductivity and electrical insulation. The thermal pad can meet environmental temperatures of -60~200 ℃ and can adapt to extreme outdoor weather conditions.
Thermal insulation film can be used for heat dissipation between IGBT, diode and heat sink in inverter power modules. It can be fastened with screws to fully contact the heat source interface and heat dissipation interface, improving heat dissipation efficiency.

The injection sealing of thermal conductive sealant (boost inductor/inverter inductor) isolates electronic components from the outside world, helps heat generating electronic components dissipate heat evenly, and also provides anti vibration, waterproof, anti-corrosion, flame retardant and other properties, greatly improving the stability of energy storage equipment working in harsh environments.