SE300AB Two-Component Thermal Gel |TOUSEN

The ​SE300AB Thermally Conductive Encapsulant​ is a specialized ​silicone gap filler​ designed for applications requiring reliable thermal management with 3.0 W/m·K conductivity. This versatile ​two-component thermal gel​ features excellent thixotropic properties, making it ideal for filling large gap tolerances while maintaining consistent performance. The material cures into a soft, elastic elastomer with Shore 00 hardness of 55±10, providing both thermal conduction and mechanical protection for electronic components.

​Technical Performance and Application Advantages

The ​SE300AB silicone gap filler​ demonstrates outstanding performance as a ​thermally conductive encapsulant​ in various electronic applications. With its optimized flow characteristics (20±5 g/min), this ​two-component thermal gel​ ensures easy application through manual or automated dispensing methods. The material's low interfacial thermal resistance and excellent dielectric properties (>8 kV/mm breakdown strength) make it suitable for power supply units, LED modules, and consumer electronics. As an effective ​silicone gap filler, it maintains stable performance across -50°C to 150°C temperature range while complying with UL94 V-0, RoHS, and REACH standards. The ​SE300AB thermally conductive encapsulant​ provides reliable thermal management solution for applications where large gap tolerances and component protection are primary considerations.