US-5201-20 Thermal Potting Compound | 2.0W/mK | TOUSEN
US-5201-20
The US-5201-20 Thermal Potting Compound is a two-component liquid encapsulation material designed for electronic applications requiring enhanced thermal management performance. With a thermal conductivity of 2.0W/m·K and viscosity range of 6,000-6,500cPs, this potting compound provides efficient heat dissipation while maintaining reliable electrical insulation properties. The material features a precise 1:1 mass mixing ratio and uniform density of 2.6±0.1g/cm³ for both components, ensuring consistent mixing and curing characteristics.
This thermal potting material delivers robust dielectric performance with a dielectric constant ≤5.5 at 1MHz and volume resistivity >1×10¹² Ω·cm, providing effective electrical insulation in demanding electronic applications. The compound offers comprehensive environmental protection against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for enhanced circuit protection. Its Shore A hardness of 20±5 after curing ensures mechanical protection while maintaining adequate flexibility for various application requirements.
Applications include high-power LED drivers, automotive control units, industrial inverters, and power supply systems where improved thermal conductivity and environmental sealing are essential. The material's 60-minute operating time provides sufficient processing flexibility for complex encapsulation procedures. With its higher viscosity characteristics compared to lower-grade variants, the US-5201-20 is particularly suitable for applications requiring better thermal performance and structural stability.
The potting compound cures to form a durable protective barrier that enhances the reliability of electronic assemblies in challenging operating conditions. Its balanced combination of thermal conductivity and electrical insulation properties makes it ideal for power electronics applications where both heat management and electrical safety are critical considerations. The
This thermal potting material delivers robust dielectric performance with a dielectric constant ≤5.5 at 1MHz and volume resistivity >1×10¹² Ω·cm, providing effective electrical insulation in demanding electronic applications. The compound offers comprehensive environmental protection against moisture, dust, chemicals, and mechanical vibration, with dielectric strength exceeding 10kV/mm for enhanced circuit protection. Its Shore A hardness of 20±5 after curing ensures mechanical protection while maintaining adequate flexibility for various application requirements.
Applications include high-power LED drivers, automotive control units, industrial inverters, and power supply systems where improved thermal conductivity and environmental sealing are essential. The material's 60-minute operating time provides sufficient processing flexibility for complex encapsulation procedures. With its higher viscosity characteristics compared to lower-grade variants, the US-5201-20 is particularly suitable for applications requiring better thermal performance and structural stability.
The potting compound cures to form a durable protective barrier that enhances the reliability of electronic assemblies in challenging operating conditions. Its balanced combination of thermal conductivity and electrical insulation properties makes it ideal for power electronics applications where both heat management and electrical safety are critical considerations. The
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Product Description
US Series Thermal Potting Compounds are renowned for their distinctive characteristics, which include:
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
◆High Thermal Conductivity: Efficiently transfers heat from heat-generating components to heat sinks or enclosures, preventing overheating.
◆Electrical Insulation: Provides strong dielectric properties to avoid short circuits between adjacent electronic parts, ensuring operational safety.
◆Environmental Sealing: Resists moisture, dust, chemicals, and vibration after curing, forming a durable protective barrier around components.
◆Wide Temperature Resistance: Maintains stability across a broad range, adapting to harsh operating conditions.
【Applications】
◆Electronic Components: Used in LED drivers, power supplies, and integrated circuits (ICs) to dissipate heat and shield against humidity/dust.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
◆Automotive Electronics: Applied in automotive ECUs (Engine Control Units), sensor modules, and battery management systems (BMS) to withstand vibration, temperature fluctuations, and engine oil exposure.
◆Industrial Equipment: Encapsulates inverters, motor controllers, and industrial sensors in factories to protect against mechanical shock and chemical corrosion.
◆New Energy Systems: Used in solar inverters and lithium-ion battery packs to manage heat buildup and enhance long-term reliability.
Properties
| Item | Unit | US-5210-20 |
|---|---|---|
| Color | - | A: White B:Gray |
| Viscosity | cPs | 6000 ~ 6500 |
| Density | g/cm3 | A: 2.6±0.1 B: 2.6±0.1 |
| Before Mixing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Mass Ratio | - | 1:1 |
| Mixed Viscosity | cPs | 6000 ~ 6500 |
| Operating Time | min | 60 |
| Performance After Curing(Test Environment: 25℃; Relative Humility: 55%) | ||
| Hardness | Shore A | 20±5 |
| Dielectric Strength | kV/mm | >10 |
| Volume Resistance | Ω·cm | >1*1012 |
| Dielectric Constant | 1MHz | ≤5.5 |
| Thermal Conductivity | W/m·k | 2.0 |
