TSAD66 Medium-Viscosity Thermal Paste | TOUSEN

The ​TSAD66 Medium-Viscosity Thermal Paste​ is an optimized ​easy-application thermal interface material​ designed for efficient thermal management in mainstream electronic applications. This balanced ​thermal compound​ delivers reliable 3.5 W/m·K thermal conductivity with a thermal resistance of 0.08°C·cm²/W at 25 N/cm², positioning it as a ​cost-effective thermal solution​ for standard cooling requirements. The ​thermal paste​ features a precisely calibrated 95 Pa·s viscosity profile that enables smooth manual or automated dispensing, ensuring exceptional workability and surface coverage as an ​easy-application TIM.

Technical Performance and Value Advantages

The ​TSAD66 thermal compound​ demonstrates superior stability with minimal oil separation (<0.02% at 150°C) and low evaporation loss (0.15% at 120°C), providing consistent long-term performance. This ​easy-application thermal interface material​ achieves optimal wetting characteristics for rapid assembly processes, reducing manufacturing time while maintaining a thin bond line (0.03–0.05mm). With volume resistivity >10¹² Ω·cm and specific gravity of 2.7 g/cm³, this ​medium-viscosity thermal paste​ offers reliable electrical insulation alongside efficient heat transfer. The non-curing silicone formulation ensures zero pump-out or drying issues, making it ideal for consumer electronics, LED drivers, and industrial controllers where ​cost-effective thermal solutions​ with excellent workability are prioritized over ultra-low thermal resistance specifications.