TSAD88 PLUS Low Thermal Resistance Thermal Paste | TOUSEN

The ​TSAD88 PLUS Low Thermal Resistance Thermal Paste​ represents an advanced ​screen-printable thermal interface material​ engineered for high-performance electronic cooling applications. This premium ​thermal grease​ delivers exceptional 5.2 W/m·K thermal conductivity while achieving ultra-low thermal resistance of 0.03°C·cm²/W at 25 N/cm² pressure. The specialized silicone-based formulation features optimized viscosity characteristics (110 Pa·s) that enable excellent ​screen-printable​ application performance while maintaining superior stability against slumping and migration.

​Technical Performance and Application Advantages

The ​TSAD88 PLUS thermal paste​ demonstrates outstanding stability with minimal volatile content (0.13% after 48 hours at 125°C), ensuring long-term reliability in demanding operating conditions. This ​low thermal resistance thermal grease​ achieves an exceptionally thin bond line thickness of 0.03mm, maximizing heat transfer efficiency between components and heat sinks. The material's ​screen-printable​ characteristics make it ideal for high-volume manufacturing processes, particularly for CPU/GPU thermal management, power supply units, and automotive electronics applications. With its non-curing formulation and specific gravity of 2.9, this ​thermal interface material​ maintains consistent performance without pump-out or drying issues. The product complies with international standards and offers 12-month shelf life, providing reliable thermal management solution for applications where precision application and sustained thermal performance are critical requirements.